JPH0518676B2 - - Google Patents
Info
- Publication number
- JPH0518676B2 JPH0518676B2 JP2045614A JP4561490A JPH0518676B2 JP H0518676 B2 JPH0518676 B2 JP H0518676B2 JP 2045614 A JP2045614 A JP 2045614A JP 4561490 A JP4561490 A JP 4561490A JP H0518676 B2 JPH0518676 B2 JP H0518676B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- sheet
- end surface
- gas exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 107
- 230000004907 flux Effects 0.000 claims description 81
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000012190 activator Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 239000006071 cream Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 239000008188 pellet Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045614A JPH03254393A (ja) | 1990-02-28 | 1990-02-28 | 溝付きシート状はんだおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045614A JPH03254393A (ja) | 1990-02-28 | 1990-02-28 | 溝付きシート状はんだおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03254393A JPH03254393A (ja) | 1991-11-13 |
| JPH0518676B2 true JPH0518676B2 (enrdf_load_stackoverflow) | 1993-03-12 |
Family
ID=12724255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2045614A Granted JPH03254393A (ja) | 1990-02-28 | 1990-02-28 | 溝付きシート状はんだおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03254393A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004344958A (ja) * | 2003-05-23 | 2004-12-09 | Sentan Zairyo:Kk | 炭素アルミニウム複合材料または炭化珪素アルミニウム複合材料に金属を接合したハイブリッド材料および該ハイブリッド材料を用いた熱交換器用部品 |
| US8678271B2 (en) * | 2007-06-26 | 2014-03-25 | Globalfoundries Inc. | Method for preventing void formation in a solder joint |
| JP5214483B2 (ja) * | 2009-02-06 | 2013-06-19 | リコーマイクロエレクトロニクス株式会社 | 電子部品加工方法、及び電子部品実装方法 |
| JP5688837B2 (ja) * | 2010-10-21 | 2015-03-25 | 三菱アルミニウム株式会社 | 電気絶縁部材とろう付されるアルミニウム部材および電気絶縁部材 |
| JP6944907B2 (ja) * | 2018-07-27 | 2021-10-06 | 株式会社 日立パワーデバイス | 半導体装置の製造方法および半導体装置ならびに半田シートおよびその製造方法 |
-
1990
- 1990-02-28 JP JP2045614A patent/JPH03254393A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03254393A (ja) | 1991-11-13 |
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