JPH0515317B2 - - Google Patents
Info
- Publication number
- JPH0515317B2 JPH0515317B2 JP33357288A JP33357288A JPH0515317B2 JP H0515317 B2 JPH0515317 B2 JP H0515317B2 JP 33357288 A JP33357288 A JP 33357288A JP 33357288 A JP33357288 A JP 33357288A JP H0515317 B2 JPH0515317 B2 JP H0515317B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- conductive paste
- wiring board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33357288A JPH02177587A (ja) | 1988-12-28 | 1988-12-28 | プリント配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33357288A JPH02177587A (ja) | 1988-12-28 | 1988-12-28 | プリント配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02177587A JPH02177587A (ja) | 1990-07-10 |
JPH0515317B2 true JPH0515317B2 (de) | 1993-03-01 |
Family
ID=18267542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33357288A Granted JPH02177587A (ja) | 1988-12-28 | 1988-12-28 | プリント配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02177587A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3265669B2 (ja) * | 1993-01-19 | 2002-03-11 | 株式会社デンソー | プリント基板 |
JP6873217B1 (ja) * | 2019-12-05 | 2021-05-19 | 三菱電機株式会社 | 電力変換装置 |
-
1988
- 1988-12-28 JP JP33357288A patent/JPH02177587A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH02177587A (ja) | 1990-07-10 |
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