JPH0514515Y2 - - Google Patents

Info

Publication number
JPH0514515Y2
JPH0514515Y2 JP1986193881U JP19388186U JPH0514515Y2 JP H0514515 Y2 JPH0514515 Y2 JP H0514515Y2 JP 1986193881 U JP1986193881 U JP 1986193881U JP 19388186 U JP19388186 U JP 19388186U JP H0514515 Y2 JPH0514515 Y2 JP H0514515Y2
Authority
JP
Japan
Prior art keywords
package
circuit board
absorbing member
stress absorbing
plastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986193881U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6398642U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986193881U priority Critical patent/JPH0514515Y2/ja
Priority to US07/116,662 priority patent/US4833570A/en
Publication of JPS6398642U publication Critical patent/JPS6398642U/ja
Application granted granted Critical
Publication of JPH0514515Y2 publication Critical patent/JPH0514515Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986193881U 1986-12-16 1986-12-16 Expired - Lifetime JPH0514515Y2 (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986193881U JPH0514515Y2 (enExample) 1986-12-16 1986-12-16
US07/116,662 US4833570A (en) 1986-12-16 1987-11-03 Electronic circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986193881U JPH0514515Y2 (enExample) 1986-12-16 1986-12-16

Publications (2)

Publication Number Publication Date
JPS6398642U JPS6398642U (enExample) 1988-06-25
JPH0514515Y2 true JPH0514515Y2 (enExample) 1993-04-19

Family

ID=31150324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986193881U Expired - Lifetime JPH0514515Y2 (enExample) 1986-12-16 1986-12-16

Country Status (1)

Country Link
JP (1) JPH0514515Y2 (enExample)

Also Published As

Publication number Publication date
JPS6398642U (enExample) 1988-06-25

Similar Documents

Publication Publication Date Title
CN111422819B (zh) 传感器封装结构及其封装方法、以及电子设备
US5438480A (en) Printed circuit board and electronic parts to be mounted thereon
JP3288925B2 (ja) 電子装置及びその製造方法
JPS58188684U (ja) 電子表示装置
JP2595947B2 (ja) 可塑性樹脂コーテイング用ｉｃパツケージ
JPH0478015B2 (enExample)
JPH0423343Y2 (enExample)
JP2545968Y2 (ja) 電子回路基板に垂直に実装されたコンデンサの支え
JP2582801B2 (ja) 半導体パッケージの半田付方法
JPH049650Y2 (enExample)
CN210405783U (zh) 一种电路板结构及行扫描电路板
JP2000049041A (ja) コンデンサ
JPS62134957A (ja) 半導体装置
JPS5911658A (ja) 半導体装置
JP2005017890A (ja) 液晶表示装置
JPH0322918Y2 (enExample)
JPH072065Y2 (ja) ピン転写ヘッド
JPH019943Y2 (enExample)
JPS61222794A (ja) Ｉｃカ−ド
JPS6012303Y2 (ja) プリント基板の絶縁保護装置
JPS627566Y2 (enExample)
CN114286531A (zh) 遮蔽装置及涂覆治具
JPS63316445A (ja) 混成集積回路の外装形成方法
WO2026100513A1 (ja) 回路基板
JPH03122569U (enExample)