JPH0514510Y2 - - Google Patents
Info
- Publication number
- JPH0514510Y2 JPH0514510Y2 JP13230987U JP13230987U JPH0514510Y2 JP H0514510 Y2 JPH0514510 Y2 JP H0514510Y2 JP 13230987 U JP13230987 U JP 13230987U JP 13230987 U JP13230987 U JP 13230987U JP H0514510 Y2 JPH0514510 Y2 JP H0514510Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- runner
- lead frame
- holding
- upper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230987U JPH0514510Y2 (enrdf_load_stackoverflow) | 1987-09-01 | 1987-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13230987U JPH0514510Y2 (enrdf_load_stackoverflow) | 1987-09-01 | 1987-09-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6439636U JPS6439636U (enrdf_load_stackoverflow) | 1989-03-09 |
| JPH0514510Y2 true JPH0514510Y2 (enrdf_load_stackoverflow) | 1993-04-19 |
Family
ID=31389151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13230987U Expired - Lifetime JPH0514510Y2 (enrdf_load_stackoverflow) | 1987-09-01 | 1987-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514510Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-09-01 JP JP13230987U patent/JPH0514510Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6439636U (enrdf_load_stackoverflow) | 1989-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5043199A (en) | Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet | |
| JPH03217032A (ja) | 半導体装置の樹脂封止装置、樹脂封止方法及び樹脂封止型半導体装置 | |
| US5254501A (en) | Same-side gated process for encapsulating semiconductor devices | |
| JPH0514510Y2 (enrdf_load_stackoverflow) | ||
| JPH0794543A (ja) | 半導体パッケージ成形用モルドプレス | |
| JP3633924B2 (ja) | 樹脂成形装置 | |
| JP2004259761A (ja) | 樹脂封止金型、それを用いた樹脂封止方法および樹脂封止装置 | |
| JP2581113B2 (ja) | 半導体装置のモールド方法および装置 | |
| JPS60257528A (ja) | 半導体封止用金型 | |
| JP3844195B2 (ja) | ウェハーの樹脂封止装置 | |
| JPH09262876A (ja) | 成型方法及び半導体集積回路装置用パッケージの成型方法並びに成型装置 | |
| JP2957565B1 (ja) | 半導体素子の樹脂封止金型 | |
| KR100201913B1 (ko) | 트랜스퍼 몰딩법 | |
| JP2502387B2 (ja) | 半導体素子の樹脂封止方法及び樹脂封止金型 | |
| JPS60125616A (ja) | 樹脂封止用金型 | |
| JP2582466B2 (ja) | 半導体装置の製造方法 | |
| JPH05237864A (ja) | 樹脂封止型半導体装置の製造方法及びそれに用いる治具 | |
| JP2774965B2 (ja) | 樹脂封止装置 | |
| JPH07319B2 (ja) | トランスフアモ−ルドプレス | |
| JPH0494549A (ja) | 電子部品の樹脂封止装置 | |
| JPH0671685A (ja) | 樹脂成形装置 | |
| JPS6395634A (ja) | 半導体装置の樹脂封止装置 | |
| JP2808779B2 (ja) | 半導体素子の樹脂封入成形機 | |
| JPH03232245A (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPH0250442A (ja) | ランナーとｉｃパッケージの分離機構 |