JPH0514363B2 - - Google Patents
Info
- Publication number
- JPH0514363B2 JPH0514363B2 JP61102677A JP10267786A JPH0514363B2 JP H0514363 B2 JPH0514363 B2 JP H0514363B2 JP 61102677 A JP61102677 A JP 61102677A JP 10267786 A JP10267786 A JP 10267786A JP H0514363 B2 JPH0514363 B2 JP H0514363B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- silver
- conductive paste
- powder
- glass frit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 25
- 229910052709 silver Inorganic materials 0.000 claims description 21
- 239000004332 silver Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 16
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 11
- 239000005388 borosilicate glass Substances 0.000 claims description 9
- 239000002612 dispersion medium Substances 0.000 claims description 7
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000011521 glass Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000032683 aging Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62259302A JPS62259302A (ja) | 1987-11-11 |
| JPH0514363B2 true JPH0514363B2 (de) | 1993-02-24 |
Family
ID=14333862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267786A Granted JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62259302A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015141816A1 (ja) * | 2014-03-20 | 2015-09-24 | ナミックス株式会社 | 導電性ペースト、積層セラミック部品、プリント配線板、及び電子装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2653314B2 (ja) * | 1992-02-07 | 1997-09-17 | 鳴海製陶株式会社 | 電磁調理用容器 |
| JP2001052930A (ja) * | 1999-08-06 | 2001-02-23 | Tdk Corp | 積層インダクタとその製造方法 |
| US7462304B2 (en) * | 2005-04-14 | 2008-12-09 | E.I. Du Pont De Nemours And Company | Conductive compositions used in the manufacture of semiconductor device |
| CN101964219B (zh) * | 2010-08-10 | 2013-02-06 | 上海九晶电子材料股份有限公司 | 晶体硅太阳能电池正面用银浆及其制备方法 |
| JP5817188B2 (ja) * | 2011-04-11 | 2015-11-18 | Tdk株式会社 | 導体用ペースト、ガラスセラミックス基板および電子部品モジュール |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (ja) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | 導体組成物 |
-
1986
- 1986-05-02 JP JP10267786A patent/JPS62259302A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (ja) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | 導体組成物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015141816A1 (ja) * | 2014-03-20 | 2015-09-24 | ナミックス株式会社 | 導電性ペースト、積層セラミック部品、プリント配線板、及び電子装置 |
| JPWO2015141816A1 (ja) * | 2014-03-20 | 2017-04-13 | ナミックス株式会社 | 導電性ペースト、積層セラミック部品、プリント配線板、及び電子装置 |
| US10702954B2 (en) | 2014-03-20 | 2020-07-07 | Namics Corporation | Conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62259302A (ja) | 1987-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |