JPH0512999Y2 - - Google Patents
Info
- Publication number
- JPH0512999Y2 JPH0512999Y2 JP10850589U JP10850589U JPH0512999Y2 JP H0512999 Y2 JPH0512999 Y2 JP H0512999Y2 JP 10850589 U JP10850589 U JP 10850589U JP 10850589 U JP10850589 U JP 10850589U JP H0512999 Y2 JPH0512999 Y2 JP H0512999Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- cylindrical chip
- metal cap
- metal
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 44
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 20
- 238000005476 soldering Methods 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000006071 cream Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10850589U JPH0512999Y2 (US07709020-20100504-C00041.png) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10850589U JPH0512999Y2 (US07709020-20100504-C00041.png) | 1989-09-16 | 1989-09-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0348218U JPH0348218U (US07709020-20100504-C00041.png) | 1991-05-08 |
JPH0512999Y2 true JPH0512999Y2 (US07709020-20100504-C00041.png) | 1993-04-06 |
Family
ID=31657144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10850589U Expired - Lifetime JPH0512999Y2 (US07709020-20100504-C00041.png) | 1989-09-16 | 1989-09-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0512999Y2 (US07709020-20100504-C00041.png) |
-
1989
- 1989-09-16 JP JP10850589U patent/JPH0512999Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0348218U (US07709020-20100504-C00041.png) | 1991-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0421327B2 (US07709020-20100504-C00041.png) | ||
US6856234B2 (en) | Chip resistor | |
JPH0512999Y2 (US07709020-20100504-C00041.png) | ||
JPH0818285A (ja) | 表面実装部品の実装装置とその実装方法 | |
JP3836263B2 (ja) | アキシャルリード型電子部品及びアキシャルリード型電子部品実装回路基板装置 | |
JPH0624970Y2 (ja) | 巻線部品用ドラムコア | |
JPH0512998Y2 (US07709020-20100504-C00041.png) | ||
JPH0432741Y2 (US07709020-20100504-C00041.png) | ||
JPH0312446B2 (US07709020-20100504-C00041.png) | ||
JPH08222478A (ja) | チップ型電子部品 | |
JPH0254618B2 (US07709020-20100504-C00041.png) | ||
JPS643333B2 (US07709020-20100504-C00041.png) | ||
JPH0621237U (ja) | チップ部品 | |
JPS6221298A (ja) | チツプ形電子部品の実装方法 | |
JPH0629152U (ja) | 面実装用電子部品 | |
JPH0590984U (ja) | 印刷回路基板 | |
JPH0766074A (ja) | 表面実装部品 | |
JPH0410709Y2 (US07709020-20100504-C00041.png) | ||
JPH11102836A (ja) | 電子部品 | |
JP2003142812A (ja) | チップ部品の実装方法 | |
JPH0336788A (ja) | 面実装型電子部品およびその実装方法 | |
JP2509489Y2 (ja) | 混成集積回路基板 | |
JPH07297526A (ja) | プリント基板 | |
JP2546614Y2 (ja) | チップ形コンデンサ | |
JPH08116152A (ja) | 回路基板構体 |