JPH0512975Y2 - - Google Patents
Info
- Publication number
- JPH0512975Y2 JPH0512975Y2 JP1986105586U JP10558686U JPH0512975Y2 JP H0512975 Y2 JPH0512975 Y2 JP H0512975Y2 JP 1986105586 U JP1986105586 U JP 1986105586U JP 10558686 U JP10558686 U JP 10558686U JP H0512975 Y2 JPH0512975 Y2 JP H0512975Y2
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- chip
- inductance element
- drum
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 238000004804 winding Methods 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 230000004907 flux Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105586U JPH0512975Y2 (ko) | 1986-07-11 | 1986-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986105586U JPH0512975Y2 (ko) | 1986-07-11 | 1986-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6312809U JPS6312809U (ko) | 1988-01-27 |
| JPH0512975Y2 true JPH0512975Y2 (ko) | 1993-04-06 |
Family
ID=30980155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986105586U Expired - Lifetime JPH0512975Y2 (ko) | 1986-07-11 | 1986-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0512975Y2 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3131784B2 (ja) * | 1990-02-07 | 2001-02-05 | ティーディーケイ株式会社 | 磁気シールド型インダクタ及びその製造方法 |
| JP5974935B2 (ja) * | 2013-03-05 | 2016-08-23 | Tdk株式会社 | 電子ペン用コイル装置 |
| JP5974855B2 (ja) * | 2012-11-15 | 2016-08-23 | Tdk株式会社 | 電子ペン用コイル装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629689Y2 (ko) * | 1980-11-17 | 1987-03-06 |
-
1986
- 1986-07-11 JP JP1986105586U patent/JPH0512975Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6312809U (ko) | 1988-01-27 |
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