JPS6223065Y2 - - Google Patents
Info
- Publication number
- JPS6223065Y2 JPS6223065Y2 JP1981080869U JP8086981U JPS6223065Y2 JP S6223065 Y2 JPS6223065 Y2 JP S6223065Y2 JP 1981080869 U JP1981080869 U JP 1981080869U JP 8086981 U JP8086981 U JP 8086981U JP S6223065 Y2 JPS6223065 Y2 JP S6223065Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- core member
- chip
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981080869U JPS6223065Y2 (ko) | 1981-06-01 | 1981-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981080869U JPS6223065Y2 (ko) | 1981-06-01 | 1981-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57193209U JPS57193209U (ko) | 1982-12-07 |
| JPS6223065Y2 true JPS6223065Y2 (ko) | 1987-06-12 |
Family
ID=29876402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981080869U Expired JPS6223065Y2 (ko) | 1981-06-01 | 1981-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223065Y2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (ja) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | チップ型コイル部品 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5940739Y2 (ja) * | 1979-01-08 | 1984-11-20 | 株式会社村田製作所 | インダクタンス素子 |
-
1981
- 1981-06-01 JP JP1981080869U patent/JPS6223065Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (ja) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | チップ型コイル部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57193209U (ko) | 1982-12-07 |
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