JPH0512068B2 - - Google Patents

Info

Publication number
JPH0512068B2
JPH0512068B2 JP61118288A JP11828886A JPH0512068B2 JP H0512068 B2 JPH0512068 B2 JP H0512068B2 JP 61118288 A JP61118288 A JP 61118288A JP 11828886 A JP11828886 A JP 11828886A JP H0512068 B2 JPH0512068 B2 JP H0512068B2
Authority
JP
Japan
Prior art keywords
solder
nozzle
passage
soldering
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61118288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62275567A (ja
Inventor
Kazuo Sotono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP11828886A priority Critical patent/JPS62275567A/ja
Publication of JPS62275567A publication Critical patent/JPS62275567A/ja
Publication of JPH0512068B2 publication Critical patent/JPH0512068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11828886A 1986-05-22 1986-05-22 噴流式はんだ付け装置 Granted JPS62275567A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11828886A JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11828886A JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS62275567A JPS62275567A (ja) 1987-11-30
JPH0512068B2 true JPH0512068B2 (enrdf_load_stackoverflow) 1993-02-17

Family

ID=14732960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11828886A Granted JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS62275567A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4674436B2 (ja) * 2003-09-01 2011-04-20 パナソニック株式会社 噴流式はんだ付け装置
CN101160193B (zh) 2005-03-18 2010-05-19 千住金属工业株式会社 喷射焊料槽

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
JPS58139457A (ja) * 1982-02-15 1983-08-18 Hitachi Ltd 噴流半田槽

Also Published As

Publication number Publication date
JPS62275567A (ja) 1987-11-30

Similar Documents

Publication Publication Date Title
CN102365910B (zh) 局部喷流锡焊装置及局部喷流锡焊方法
US6770149B2 (en) Method and apparatus for cleaning treatment
JP3638415B2 (ja) ガス雰囲気はんだ付け装置
JPH0512068B2 (enrdf_load_stackoverflow)
JPH04230018A (ja) ホトレジストの光灰化装置
JP2005019510A (ja) 噴流式半田付け方法及びこれを用いた噴流式半田付け装置
JPS62275568A (ja) 噴流式はんだ付け装置
CN115410964B (zh) 一种晶圆水平清洗装置
JP2819807B2 (ja) 冷却モジュール
US4951597A (en) Solder coating device with oxide collecting trough
JP2000071066A (ja) 窒素パッケージ一体型半田槽
JP2000323826A (ja) 噴流はんだ槽
JPH0327301B2 (enrdf_load_stackoverflow)
JP3615659B2 (ja) 缶詰内への窒素ガス封入方法
JPH11340178A (ja) ウエハ洗浄装置
JP3286064B2 (ja) ウエーハのめっき用ラック及びそれを用いためっき方法
JPH0441976Y2 (enrdf_load_stackoverflow)
JP3702278B2 (ja) 回転メッキ装置及び電子部品の製造方法
JPH0592259A (ja) 不活性ガス雰囲気の半田付け装置
JP2000277903A (ja) はんだ付け装置
JPS63137570A (ja) 噴流式はんだ付け装置
JP2636892B2 (ja) 半田コート方法
JP2002043732A (ja) 噴流はんだ槽
JPH06198426A (ja) 自動半田付け装置
JPS63238283A (ja) セラミツクパツケ−ジの部分メツキ方法及びその装置