JPS62275567A - 噴流式はんだ付け装置 - Google Patents

噴流式はんだ付け装置

Info

Publication number
JPS62275567A
JPS62275567A JP11828886A JP11828886A JPS62275567A JP S62275567 A JPS62275567 A JP S62275567A JP 11828886 A JP11828886 A JP 11828886A JP 11828886 A JP11828886 A JP 11828886A JP S62275567 A JPS62275567 A JP S62275567A
Authority
JP
Japan
Prior art keywords
solder
nozzle
molten solder
pump
molten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11828886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0512068B2 (enrdf_load_stackoverflow
Inventor
Kazuo Sotono
外野　一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP11828886A priority Critical patent/JPS62275567A/ja
Publication of JPS62275567A publication Critical patent/JPS62275567A/ja
Publication of JPH0512068B2 publication Critical patent/JPH0512068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11828886A 1986-05-22 1986-05-22 噴流式はんだ付け装置 Granted JPS62275567A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11828886A JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11828886A JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS62275567A true JPS62275567A (ja) 1987-11-30
JPH0512068B2 JPH0512068B2 (enrdf_load_stackoverflow) 1993-02-17

Family

ID=14732960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11828886A Granted JPS62275567A (ja) 1986-05-22 1986-05-22 噴流式はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS62275567A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005074478A (ja) * 2003-09-01 2005-03-24 Matsushita Electric Ind Co Ltd 噴流式はんだ付け装置
EP1859886A4 (en) * 2005-03-18 2010-01-13 Senju Metal Industry Co STRAHLLOTBEHÄLTNIS

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
JPS58139457A (ja) * 1982-02-15 1983-08-18 Hitachi Ltd 噴流半田槽

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
JPS58139457A (ja) * 1982-02-15 1983-08-18 Hitachi Ltd 噴流半田槽

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005074478A (ja) * 2003-09-01 2005-03-24 Matsushita Electric Ind Co Ltd 噴流式はんだ付け装置
EP1859886A4 (en) * 2005-03-18 2010-01-13 Senju Metal Industry Co STRAHLLOTBEHÄLTNIS
US7988030B2 (en) 2005-03-18 2011-08-02 Senju Metal Industry Co., Ltd. Wave soldering bath

Also Published As

Publication number Publication date
JPH0512068B2 (enrdf_load_stackoverflow) 1993-02-17

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