JPH0511009B2 - - Google Patents
Info
- Publication number
- JPH0511009B2 JPH0511009B2 JP15545084A JP15545084A JPH0511009B2 JP H0511009 B2 JPH0511009 B2 JP H0511009B2 JP 15545084 A JP15545084 A JP 15545084A JP 15545084 A JP15545084 A JP 15545084A JP H0511009 B2 JPH0511009 B2 JP H0511009B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plate
- ejection
- protruding
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15545084A JPS6135214A (ja) | 1984-07-27 | 1984-07-27 | 2段突出し金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15545084A JPS6135214A (ja) | 1984-07-27 | 1984-07-27 | 2段突出し金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6135214A JPS6135214A (ja) | 1986-02-19 |
JPH0511009B2 true JPH0511009B2 (ko) | 1993-02-12 |
Family
ID=15606306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15545084A Granted JPS6135214A (ja) | 1984-07-27 | 1984-07-27 | 2段突出し金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6135214A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4003371A1 (de) * | 1990-02-05 | 1991-08-08 | Richard Herbst | Verfahren zum entformen eines formteils sowie vorrichtung zur durchfuehrung des verfahrens |
JPH03246020A (ja) * | 1990-02-23 | 1991-11-01 | Nec Tohoku Ltd | 射出成形金型における成形品突出し機構 |
US6472252B2 (en) * | 1997-07-23 | 2002-10-29 | Micron Technology, Inc. | Methods for ball grid array (BGA) encapsulation mold |
-
1984
- 1984-07-27 JP JP15545084A patent/JPS6135214A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6135214A (ja) | 1986-02-19 |
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