JPH0510359Y2 - - Google Patents

Info

Publication number
JPH0510359Y2
JPH0510359Y2 JP9871187U JP9871187U JPH0510359Y2 JP H0510359 Y2 JPH0510359 Y2 JP H0510359Y2 JP 9871187 U JP9871187 U JP 9871187U JP 9871187 U JP9871187 U JP 9871187U JP H0510359 Y2 JPH0510359 Y2 JP H0510359Y2
Authority
JP
Japan
Prior art keywords
mold
resin
dummy frame
frame
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9871187U
Other languages
English (en)
Japanese (ja)
Other versions
JPS645446U (US07922777-20110412-C00004.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9871187U priority Critical patent/JPH0510359Y2/ja
Publication of JPS645446U publication Critical patent/JPS645446U/ja
Application granted granted Critical
Publication of JPH0510359Y2 publication Critical patent/JPH0510359Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP9871187U 1987-06-26 1987-06-26 Expired - Lifetime JPH0510359Y2 (US07922777-20110412-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9871187U JPH0510359Y2 (US07922777-20110412-C00004.png) 1987-06-26 1987-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9871187U JPH0510359Y2 (US07922777-20110412-C00004.png) 1987-06-26 1987-06-26

Publications (2)

Publication Number Publication Date
JPS645446U JPS645446U (US07922777-20110412-C00004.png) 1989-01-12
JPH0510359Y2 true JPH0510359Y2 (US07922777-20110412-C00004.png) 1993-03-15

Family

ID=31325217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9871187U Expired - Lifetime JPH0510359Y2 (US07922777-20110412-C00004.png) 1987-06-26 1987-06-26

Country Status (1)

Country Link
JP (1) JPH0510359Y2 (US07922777-20110412-C00004.png)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878550B2 (ja) * 2000-08-04 2007-02-07 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2012114305A (ja) * 2010-11-26 2012-06-14 Apic Yamada Corp ダミーフレーム及び樹脂モールド方法
JP6093834B2 (ja) * 2015-10-29 2017-03-08 アピックヤマダ株式会社 ダミーフレーム、樹脂モールド評価方法、モールド金型の評価方法、およびモールド金型の製造方法

Also Published As

Publication number Publication date
JPS645446U (US07922777-20110412-C00004.png) 1989-01-12

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