JPH0510359Y2 - - Google Patents
Info
- Publication number
- JPH0510359Y2 JPH0510359Y2 JP9871187U JP9871187U JPH0510359Y2 JP H0510359 Y2 JPH0510359 Y2 JP H0510359Y2 JP 9871187 U JP9871187 U JP 9871187U JP 9871187 U JP9871187 U JP 9871187U JP H0510359 Y2 JPH0510359 Y2 JP H0510359Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- dummy frame
- frame
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 238000004140 cleaning Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9871187U JPH0510359Y2 (US07922777-20110412-C00004.png) | 1987-06-26 | 1987-06-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9871187U JPH0510359Y2 (US07922777-20110412-C00004.png) | 1987-06-26 | 1987-06-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS645446U JPS645446U (US07922777-20110412-C00004.png) | 1989-01-12 |
JPH0510359Y2 true JPH0510359Y2 (US07922777-20110412-C00004.png) | 1993-03-15 |
Family
ID=31325217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9871187U Expired - Lifetime JPH0510359Y2 (US07922777-20110412-C00004.png) | 1987-06-26 | 1987-06-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0510359Y2 (US07922777-20110412-C00004.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3878550B2 (ja) * | 2000-08-04 | 2007-02-07 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP2012114305A (ja) * | 2010-11-26 | 2012-06-14 | Apic Yamada Corp | ダミーフレーム及び樹脂モールド方法 |
JP6093834B2 (ja) * | 2015-10-29 | 2017-03-08 | アピックヤマダ株式会社 | ダミーフレーム、樹脂モールド評価方法、モールド金型の評価方法、およびモールド金型の製造方法 |
-
1987
- 1987-06-26 JP JP9871187U patent/JPH0510359Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS645446U (US07922777-20110412-C00004.png) | 1989-01-12 |