JPH048958B2 - - Google Patents

Info

Publication number
JPH048958B2
JPH048958B2 JP60015632A JP1563285A JPH048958B2 JP H048958 B2 JPH048958 B2 JP H048958B2 JP 60015632 A JP60015632 A JP 60015632A JP 1563285 A JP1563285 A JP 1563285A JP H048958 B2 JPH048958 B2 JP H048958B2
Authority
JP
Japan
Prior art keywords
resist
substrate
layer
activation
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60015632A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60231388A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS60231388A publication Critical patent/JPS60231388A/ja
Publication of JPH048958B2 publication Critical patent/JPH048958B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP1563285A 1984-04-25 1985-01-31 基板の活性化方法 Granted JPS60231388A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60379184A 1984-04-25 1984-04-25
US603791 1984-04-25

Publications (2)

Publication Number Publication Date
JPS60231388A JPS60231388A (ja) 1985-11-16
JPH048958B2 true JPH048958B2 (en, 2012) 1992-02-18

Family

ID=24416925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1563285A Granted JPS60231388A (ja) 1984-04-25 1985-01-31 基板の活性化方法

Country Status (3)

Country Link
EP (1) EP0163089B1 (en, 2012)
JP (1) JPS60231388A (en, 2012)
DE (1) DE3564363D1 (en, 2012)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3770896D1 (de) * 1986-09-15 1991-07-25 Gen Electric Verfahren zur photoselektiven metallisierung.
JPH0748583B2 (ja) * 1989-04-03 1995-05-24 喜平 大津 高密度プリント配線板の電気検査治具板の製造方法
US5158860A (en) * 1990-11-01 1992-10-27 Shipley Company Inc. Selective metallization process
DE4137045A1 (de) * 1991-11-11 1993-05-13 Siemens Ag Verfahren zur herstellung von lotflaechen auf einer leiterplatte und lotpastenfolie zur durchfuehrung des verfahrens
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
JPH1075038A (ja) * 1996-06-28 1998-03-17 Ngk Spark Plug Co Ltd 配線基板とその製造方法
JP3754337B2 (ja) * 2001-09-28 2006-03-08 株式会社クラレ 樹脂成形品の製造方法、樹脂成形品及び金型の製造方法
JP3990307B2 (ja) * 2003-03-24 2007-10-10 株式会社クラレ 樹脂成形品の製造方法、金属構造体の製造方法、チップ
JP2007331135A (ja) * 2006-06-12 2007-12-27 Konica Minolta Holdings Inc 電極形成方法及びインクジェットヘッドの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3506441A (en) * 1967-06-02 1970-04-14 Rca Corp Double photoresist processing
US3672925A (en) * 1970-10-02 1972-06-27 Rca Corp Method of preparing a substrate for depositing a metal on selected portions thereof
JPS518563A (en) * 1974-07-10 1976-01-23 Matsushita Electric Ind Co Ltd Insatsuhaisenbanno seizohoho
JPS5819152B2 (ja) * 1975-10-01 1983-04-16 株式会社日立製作所 インサツハイセンキバンノセイゾウホウホウ
US4180604A (en) * 1977-12-30 1979-12-25 International Business Machines Corporation Two layer resist system

Also Published As

Publication number Publication date
DE3564363D1 (en) 1988-09-15
EP0163089A3 (en) 1987-07-29
EP0163089B1 (en) 1988-08-10
JPS60231388A (ja) 1985-11-16
EP0163089A2 (en) 1985-12-04

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