JPS6321752B2 - - Google Patents

Info

Publication number
JPS6321752B2
JPS6321752B2 JP58068499A JP6849983A JPS6321752B2 JP S6321752 B2 JPS6321752 B2 JP S6321752B2 JP 58068499 A JP58068499 A JP 58068499A JP 6849983 A JP6849983 A JP 6849983A JP S6321752 B2 JPS6321752 B2 JP S6321752B2
Authority
JP
Japan
Prior art keywords
substrate
solution
plating
bath
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58068499A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5913059A (ja
Inventor
Aaru Batsupu Jeemuzu
Ii Natsupu Toreeshii
Marukoitsuchi Uoya
Jei Samubusetsutei Karurosu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5913059A publication Critical patent/JPS5913059A/ja
Publication of JPS6321752B2 publication Critical patent/JPS6321752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1855—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by mechanical pretreatment, e.g. grinding, sanding
    • C23C18/1858—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by mechanical pretreatment, e.g. grinding, sanding by formation of electrostatic charges, e.g. tribofriction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58068499A 1982-07-14 1983-04-20 無電気めつきのための前処理方法 Granted JPS5913059A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/398,140 US4478883A (en) 1982-07-14 1982-07-14 Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US398140 1995-03-03

Publications (2)

Publication Number Publication Date
JPS5913059A JPS5913059A (ja) 1984-01-23
JPS6321752B2 true JPS6321752B2 (en, 2012) 1988-05-09

Family

ID=23574147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58068499A Granted JPS5913059A (ja) 1982-07-14 1983-04-20 無電気めつきのための前処理方法

Country Status (5)

Country Link
US (1) US4478883A (en, 2012)
EP (1) EP0100452B1 (en, 2012)
JP (1) JPS5913059A (en, 2012)
CA (1) CA1191745A (en, 2012)
DE (1) DE3375588D1 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996027878A1 (fr) * 1995-03-08 1996-09-12 Migaku Takahashi Support d'enregistrement magnetique et procede de fabrication

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US4670306A (en) * 1983-09-15 1987-06-02 Seleco, Inc. Method for treatment of surfaces for electroless plating
US4888209A (en) * 1983-09-28 1989-12-19 Rohm And Haas Company Catalytic process and systems
US4719145A (en) * 1983-09-28 1988-01-12 Rohm And Haas Company Catalytic process and systems
US4554182A (en) * 1983-10-11 1985-11-19 International Business Machines Corporation Method for conditioning a surface of a dielectric substrate for electroless plating
JPS6083395A (ja) * 1983-10-11 1985-05-11 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 無電解メツキのために誘電体基板の表面を調整する方法
US4759952A (en) * 1984-01-26 1988-07-26 Learonal, Inc. Process for printed circuit board manufacture
US4761304A (en) * 1984-01-26 1988-08-02 Learonal, Inc. Process for printed circuit board manufacture
US4847114A (en) * 1984-01-26 1989-07-11 Learonal, Inc. Preparation of printed circuit boards by selective metallization
DE3530617A1 (de) * 1985-08-23 1987-02-26 Schering Ag Konditionierungsmittel fuer die behandlung von basismaterialien
US4718972A (en) * 1986-01-24 1988-01-12 International Business Machines Corporation Method of removing seed particles from circuit board substrate surface
US4748104A (en) * 1986-11-10 1988-05-31 Macdermid, Incorporated Selective metallization process and additive method for manufactured printed circuit boards
US4859571A (en) * 1986-12-30 1989-08-22 E. I. Du Pont De Nemours And Company Embedded catalyst receptors for metallization of dielectrics
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
DE3743743A1 (de) * 1987-12-23 1989-07-06 Basf Ag Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung
DE3743741A1 (de) * 1987-12-23 1989-07-06 Basf Ag Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung
US4963541A (en) * 1989-02-22 1990-10-16 Abbott Laboratories Pyrimido-pyrimidine lipoxygenase inhibiting compounds
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
US5039550A (en) * 1990-01-23 1991-08-13 The United States Of America As Represented By The Secretary Of Commerce Colloidal processing method for coating ceramic reinforcing agents
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
DE4141416A1 (de) * 1991-12-11 1993-06-17 Schering Ag Verfahren zur beschichtung von oberflaechen mit feinteiligen feststoff-partikeln
JPH0760821B2 (ja) * 1991-05-17 1995-06-28 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリマー基材の状態調整方法
US5316803A (en) * 1992-12-10 1994-05-31 International Business Machines Corporation Method for forming electrical interconnections in laminated vias
US5374346A (en) * 1993-08-09 1994-12-20 Rohm And Haas Company Electroplating process and composition
US5495665A (en) * 1994-11-04 1996-03-05 International Business Machines Corporation Process for providing a landless via connection
EP0747507B1 (en) 1994-12-27 2001-02-14 Ibiden Co., Ltd. Pretreatment solution for electroless plating, electroless plating bath and electroless plating method
US5626736A (en) 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US6110396A (en) 1996-11-27 2000-08-29 International Business Machines Corporation Dual-valent rare earth additives to polishing slurries
US5876490A (en) * 1996-12-09 1999-03-02 International Business Machines Corporatin Polish process and slurry for planarization
US5997997A (en) * 1997-06-13 1999-12-07 International Business Machines Corp. Method for reducing seed deposition in electroless plating
US6025057A (en) * 1997-12-17 2000-02-15 International Business Machines Corporation Organic electronic package and method of applying palladium-tin seed layer thereto
WO1999064527A1 (en) 1998-06-10 1999-12-16 Rodel Holdings, Inc. Composition and method for polishing in metal cmp
US6730409B1 (en) * 1999-05-27 2004-05-04 International Business Machines Corporation Promoting adhesion between a polymer and a metallic substrate
US6630743B2 (en) 2001-02-27 2003-10-07 International Business Machines Corporation Copper plated PTH barrels and methods for fabricating
US7148566B2 (en) * 2001-03-26 2006-12-12 International Business Machines Corporation Method and structure for an organic package with improved BGA life
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20040091818A1 (en) * 2002-11-12 2004-05-13 Russell Winstead High resolution 3-D circuit formation using selective or continuous catalytic painting
KR100717927B1 (ko) 2005-01-14 2007-05-11 주식회사 엘지화학 무전해 도금 공정용 팔라듐 촉매 용액의 제조방법 및 그의활성화 방법
JP2007262542A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp 金属膜形成方法、金属膜形成用基板、金属膜積層体、金属パターン形成方法、金属パターン形成用基板、金属パターン材料、及び、ポリマー前駆体層形成用塗布液組成物
CN101842856B (zh) * 2007-08-31 2013-10-09 埃托特克德国有限公司 处理表面以促进感兴趣的分子结合的方法、由其形成的涂层和器件
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
DE102010012204B4 (de) 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
JP5956553B2 (ja) * 2014-12-24 2016-07-27 キヤノン・コンポーネンツ株式会社 めっき皮膜付樹脂製品及びその製造方法
TWI615073B (zh) * 2015-04-09 2018-02-11 柏彌蘭金屬化研究股份有限公司 製成可撓式金屬積層材之方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996027878A1 (fr) * 1995-03-08 1996-09-12 Migaku Takahashi Support d'enregistrement magnetique et procede de fabrication

Also Published As

Publication number Publication date
EP0100452A1 (en) 1984-02-15
EP0100452B1 (en) 1988-02-03
DE3375588D1 (en) 1988-03-10
CA1191745A (en) 1985-08-13
US4478883A (en) 1984-10-23
JPS5913059A (ja) 1984-01-23

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