JPH0482056B2 - - Google Patents
Info
- Publication number
- JPH0482056B2 JPH0482056B2 JP61139375A JP13937586A JPH0482056B2 JP H0482056 B2 JPH0482056 B2 JP H0482056B2 JP 61139375 A JP61139375 A JP 61139375A JP 13937586 A JP13937586 A JP 13937586A JP H0482056 B2 JPH0482056 B2 JP H0482056B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- stage
- semiconductor pellet
- film carrier
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000008188 pellet Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/79—Apparatus for Tape Automated Bonding [TAB]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139375A JPS62296433A (ja) | 1986-06-17 | 1986-06-17 | 内部リ−ド接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139375A JPS62296433A (ja) | 1986-06-17 | 1986-06-17 | 内部リ−ド接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296433A JPS62296433A (ja) | 1987-12-23 |
| JPH0482056B2 true JPH0482056B2 (enrdf_load_stackoverflow) | 1992-12-25 |
Family
ID=15243858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61139375A Granted JPS62296433A (ja) | 1986-06-17 | 1986-06-17 | 内部リ−ド接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296433A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3704113B2 (ja) | 2002-09-26 | 2005-10-05 | 住友大阪セメント株式会社 | ボンディングステージ及び電子部品実装装置 |
-
1986
- 1986-06-17 JP JP61139375A patent/JPS62296433A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62296433A (ja) | 1987-12-23 |
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