JPH0481879B2 - - Google Patents
Info
- Publication number
- JPH0481879B2 JPH0481879B2 JP21634684A JP21634684A JPH0481879B2 JP H0481879 B2 JPH0481879 B2 JP H0481879B2 JP 21634684 A JP21634684 A JP 21634684A JP 21634684 A JP21634684 A JP 21634684A JP H0481879 B2 JPH0481879 B2 JP H0481879B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- holes
- hole
- multilayer wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21634684A JPS6196796A (ja) | 1984-10-17 | 1984-10-17 | 多層配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21634684A JPS6196796A (ja) | 1984-10-17 | 1984-10-17 | 多層配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196796A JPS6196796A (ja) | 1986-05-15 |
| JPH0481879B2 true JPH0481879B2 (cs) | 1992-12-25 |
Family
ID=16687108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21634684A Granted JPS6196796A (ja) | 1984-10-17 | 1984-10-17 | 多層配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196796A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155691A (ja) * | 1986-12-18 | 1988-06-28 | 株式会社東芝 | 多層配線回路基板 |
-
1984
- 1984-10-17 JP JP21634684A patent/JPS6196796A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6196796A (ja) | 1986-05-15 |
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