JPH0480536B2 - - Google Patents

Info

Publication number
JPH0480536B2
JPH0480536B2 JP60175551A JP17555185A JPH0480536B2 JP H0480536 B2 JPH0480536 B2 JP H0480536B2 JP 60175551 A JP60175551 A JP 60175551A JP 17555185 A JP17555185 A JP 17555185A JP H0480536 B2 JPH0480536 B2 JP H0480536B2
Authority
JP
Japan
Prior art keywords
bump electrode
opening
metal layer
resin film
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60175551A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6235651A (ja
Inventor
Akira Amano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP60175551A priority Critical patent/JPS6235651A/ja
Publication of JPS6235651A publication Critical patent/JPS6235651A/ja
Publication of JPH0480536B2 publication Critical patent/JPH0480536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP60175551A 1985-08-09 1985-08-09 バンプ電極の作成方法 Granted JPS6235651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60175551A JPS6235651A (ja) 1985-08-09 1985-08-09 バンプ電極の作成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60175551A JPS6235651A (ja) 1985-08-09 1985-08-09 バンプ電極の作成方法

Publications (2)

Publication Number Publication Date
JPS6235651A JPS6235651A (ja) 1987-02-16
JPH0480536B2 true JPH0480536B2 (en, 2012) 1992-12-18

Family

ID=15998055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60175551A Granted JPS6235651A (ja) 1985-08-09 1985-08-09 バンプ電極の作成方法

Country Status (1)

Country Link
JP (1) JPS6235651A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114152669A (zh) * 2021-11-12 2022-03-08 中车长江运输设备集团有限公司 一种用于复合材料夹芯板气泡缺陷检测的探头及方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5947742A (ja) * 1982-09-13 1984-03-17 Seiko Instr & Electronics Ltd はんだバンプの形成方法

Also Published As

Publication number Publication date
JPS6235651A (ja) 1987-02-16

Similar Documents

Publication Publication Date Title
US5403777A (en) Semiconductor bond pad structure and method
JP3053675B2 (ja) 半導体装置およびその製造方法
JPH0480536B2 (en, 2012)
JPH05283412A (ja) 半導体装置，およびその製造方法
JP2751242B2 (ja) 半導体装置の製造方法
JP2748530B2 (ja) 半導体装置の製造方法
JPH03198342A (ja) 半導体装置の製造方法
JPH0558653B2 (en, 2012)
JPH08330310A (ja) 半導体装置
JP2874184B2 (ja) 半導体装置の製造方法
JP2985426B2 (ja) 半導体装置およびその製造方法
JPH0244145B2 (en, 2012)
JPH06342796A (ja) 突起電極の形成方法
JP3049872B2 (ja) 半導体装置の製造方法
JPH0350734A (ja) 集積回路の製造方法
JP3297688B2 (ja) 半導体装置における突起電極形成方法
JPS61141157A (ja) 半導体素子の製造方法
JPS62281356A (ja) 半導体装置の製造方法
JP2621186B2 (ja) 転写用バンプの形成方法
JPH0546708B2 (en, 2012)
JPH06314723A (ja) 半導体装置及びその製造方法
JPS62213140A (ja) 配線の製造方法
JPH0795556B2 (ja) テープキャリアの製造方法
JPH1126625A (ja) 半導体装置用基板及びその製造方法
JPS58192351A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term