JPH0479790B2 - - Google Patents
Info
- Publication number
- JPH0479790B2 JPH0479790B2 JP60079286A JP7928685A JPH0479790B2 JP H0479790 B2 JPH0479790 B2 JP H0479790B2 JP 60079286 A JP60079286 A JP 60079286A JP 7928685 A JP7928685 A JP 7928685A JP H0479790 B2 JPH0479790 B2 JP H0479790B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- workpiece
- plates
- sun gear
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP60079286A JPS61241059A (ja) | 1985-04-16 | 1985-04-16 | 研磨装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP60079286A JPS61241059A (ja) | 1985-04-16 | 1985-04-16 | 研磨装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS61241059A JPS61241059A (ja) | 1986-10-27 | 
| JPH0479790B2 true JPH0479790B2 (OSRAM) | 1992-12-16 | 
Family
ID=13685620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP60079286A Granted JPS61241059A (ja) | 1985-04-16 | 1985-04-16 | 研磨装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS61241059A (OSRAM) | 
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same | 
| US6244941B1 (en) * | 1999-03-30 | 2001-06-12 | Speedfam - Ipec Corporation | Method and apparatus for pad removal and replacement | 
| JP6754519B2 (ja) * | 2016-02-15 | 2020-09-16 | 国立研究開発法人海洋研究開発機構 | 研磨方法 | 
| CN110625456A (zh) * | 2019-09-18 | 2019-12-31 | 缙云松弛自动化科技有限公司 | 一种吸尘式板材打磨装置 | 
| JP7023538B2 (ja) * | 2020-05-26 | 2022-02-22 | 国立研究開発法人海洋研究開発機構 | 仕上研磨用定盤、仕上研磨装置及び研磨方法 | 
| JP7156341B2 (ja) * | 2020-07-13 | 2022-10-19 | 信越半導体株式会社 | 片面研磨装置及び片面研磨方法、並びに研磨パッド | 
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS52106196A (en) * | 1976-03-03 | 1977-09-06 | Hiyoumen Kakou Gijiyutsu Kenki | Lapping device for thin works | 
| DE3319328A1 (de) * | 1982-06-01 | 1983-12-08 | General Signal Corp., 06904 Stamford, Conn. | Vorrichtung zur feinbearbeitung zerbrechlicher werkstuecke | 
- 
        1985
        - 1985-04-16 JP JP60079286A patent/JPS61241059A/ja active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS61241059A (ja) | 1986-10-27 | 
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