JPH0479160B2 - - Google Patents
Info
- Publication number
- JPH0479160B2 JPH0479160B2 JP60093646A JP9364685A JPH0479160B2 JP H0479160 B2 JPH0479160 B2 JP H0479160B2 JP 60093646 A JP60093646 A JP 60093646A JP 9364685 A JP9364685 A JP 9364685A JP H0479160 B2 JPH0479160 B2 JP H0479160B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- resin film
- filler
- forming
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229940123208 Biguanide Drugs 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9364685A JPS61252698A (ja) | 1985-05-02 | 1985-05-02 | 多層プリント回路板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9364685A JPS61252698A (ja) | 1985-05-02 | 1985-05-02 | 多層プリント回路板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61252698A JPS61252698A (ja) | 1986-11-10 |
| JPH0479160B2 true JPH0479160B2 (it) | 1992-12-15 |
Family
ID=14088131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9364685A Granted JPS61252698A (ja) | 1985-05-02 | 1985-05-02 | 多層プリント回路板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61252698A (it) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4878278A (it) * | 1972-01-20 | 1973-10-20 | ||
| JPS4929458A (it) * | 1972-07-20 | 1974-03-15 | ||
| JPS4989858A (it) * | 1972-12-29 | 1974-08-28 | ||
| JPS5133862A (en) * | 1974-09-18 | 1976-03-23 | Matsushita Electric Works Ltd | Purintohaisenkiban no seiho |
| JPS5840886A (ja) * | 1981-09-03 | 1983-03-09 | 株式会社東芝 | 電気回路基板の製造方法 |
-
1985
- 1985-05-02 JP JP9364685A patent/JPS61252698A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4878278A (it) * | 1972-01-20 | 1973-10-20 | ||
| JPS4929458A (it) * | 1972-07-20 | 1974-03-15 | ||
| JPS4989858A (it) * | 1972-12-29 | 1974-08-28 | ||
| JPS5133862A (en) * | 1974-09-18 | 1976-03-23 | Matsushita Electric Works Ltd | Purintohaisenkiban no seiho |
| JPS5840886A (ja) * | 1981-09-03 | 1983-03-09 | 株式会社東芝 | 電気回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61252698A (ja) | 1986-11-10 |
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