JPS4929458A - - Google Patents
Info
- Publication number
- JPS4929458A JPS4929458A JP7283872A JP7283872A JPS4929458A JP S4929458 A JPS4929458 A JP S4929458A JP 7283872 A JP7283872 A JP 7283872A JP 7283872 A JP7283872 A JP 7283872A JP S4929458 A JPS4929458 A JP S4929458A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7283872A JPS4929458A (it) | 1972-07-20 | 1972-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7283872A JPS4929458A (it) | 1972-07-20 | 1972-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4929458A true JPS4929458A (it) | 1974-03-15 |
Family
ID=13500935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7283872A Pending JPS4929458A (it) | 1972-07-20 | 1972-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4929458A (it) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148570A (ja) * | 1984-08-10 | 1986-03-10 | Mitsubishi Electric Corp | 樹脂への導体層形成方法 |
| JPS61252698A (ja) * | 1985-05-02 | 1986-11-10 | 株式会社日立製作所 | 多層プリント回路板の製造方法 |
| JPH02188992A (ja) * | 1989-01-18 | 1990-07-25 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| US5589255A (en) * | 1988-04-28 | 1996-12-31 | Ibiden Co., Ltd. | Adhesive for electroless plating, printed circuit boards and method of producing the same |
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1972
- 1972-07-20 JP JP7283872A patent/JPS4929458A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148570A (ja) * | 1984-08-10 | 1986-03-10 | Mitsubishi Electric Corp | 樹脂への導体層形成方法 |
| JPS61252698A (ja) * | 1985-05-02 | 1986-11-10 | 株式会社日立製作所 | 多層プリント回路板の製造方法 |
| JPH0479160B2 (it) * | 1985-05-02 | 1992-12-15 | Hitachi Ltd | |
| US5589255A (en) * | 1988-04-28 | 1996-12-31 | Ibiden Co., Ltd. | Adhesive for electroless plating, printed circuit boards and method of producing the same |
| JPH02188992A (ja) * | 1989-01-18 | 1990-07-25 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| JPH06215623A (ja) * | 1989-01-18 | 1994-08-05 | Ibiden Co Ltd | 感光性樹脂絶縁材 |