JPH0477702B2 - - Google Patents

Info

Publication number
JPH0477702B2
JPH0477702B2 JP2271688A JP2271688A JPH0477702B2 JP H0477702 B2 JPH0477702 B2 JP H0477702B2 JP 2271688 A JP2271688 A JP 2271688A JP 2271688 A JP2271688 A JP 2271688A JP H0477702 B2 JPH0477702 B2 JP H0477702B2
Authority
JP
Japan
Prior art keywords
copper
eutectic
alumina
substrate
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2271688A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01201085A (ja
Inventor
Juichi Yoshino
Hidehiko Ootsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP2271688A priority Critical patent/JPH01201085A/ja
Publication of JPH01201085A publication Critical patent/JPH01201085A/ja
Publication of JPH0477702B2 publication Critical patent/JPH0477702B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2271688A 1988-02-04 1988-02-04 電子部品用銅張りセラミック基板の製造方法 Granted JPH01201085A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2271688A JPH01201085A (ja) 1988-02-04 1988-02-04 電子部品用銅張りセラミック基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2271688A JPH01201085A (ja) 1988-02-04 1988-02-04 電子部品用銅張りセラミック基板の製造方法

Publications (2)

Publication Number Publication Date
JPH01201085A JPH01201085A (ja) 1989-08-14
JPH0477702B2 true JPH0477702B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-09

Family

ID=12090533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2271688A Granted JPH01201085A (ja) 1988-02-04 1988-02-04 電子部品用銅張りセラミック基板の製造方法

Country Status (1)

Country Link
JP (1) JPH01201085A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6236915B2 (ja) * 2013-06-25 2017-11-29 富士電機株式会社 はんだ付け方法および半導体装置の製造方法
FR3030506A1 (fr) * 2014-12-18 2016-06-24 Commissariat Energie Atomique Piece en ceramique metallisee, son procede de preparation, et procede pour assembler cette piece avec une piece en metal ou en ceramique.
CN114230359B (zh) * 2020-09-09 2023-03-14 比亚迪股份有限公司 一种陶瓷覆铜板及其制备方法

Also Published As

Publication number Publication date
JPH01201085A (ja) 1989-08-14

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