JPH0474878B2 - - Google Patents

Info

Publication number
JPH0474878B2
JPH0474878B2 JP62042649A JP4264987A JPH0474878B2 JP H0474878 B2 JPH0474878 B2 JP H0474878B2 JP 62042649 A JP62042649 A JP 62042649A JP 4264987 A JP4264987 A JP 4264987A JP H0474878 B2 JPH0474878 B2 JP H0474878B2
Authority
JP
Japan
Prior art keywords
substrate
printed circuit
electrode
electric circuit
layer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62042649A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63239895A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS63239895A publication Critical patent/JPS63239895A/ja
Publication of JPH0474878B2 publication Critical patent/JPH0474878B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electronic Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP4264987A 1986-11-19 1987-02-27 印刷回路の製造装置 Granted JPS63239895A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-274042 1986-11-19
JP27404286 1986-11-19

Publications (2)

Publication Number Publication Date
JPS63239895A JPS63239895A (ja) 1988-10-05
JPH0474878B2 true JPH0474878B2 (enExample) 1992-11-27

Family

ID=17536153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4264987A Granted JPS63239895A (ja) 1986-11-19 1987-02-27 印刷回路の製造装置

Country Status (1)

Country Link
JP (1) JPS63239895A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648700A (en) * 1987-06-30 1989-01-12 Mitsubishi Electric Corp Manufacture of printed circuit board
JPH0319297A (ja) * 1989-06-15 1991-01-28 Nec Corp 多層セラミック配線基板の製造方法
JP2010014939A (ja) * 2008-07-03 2010-01-21 Nikon Corp 回路素子の製造装置及び製造方法
JP6073603B2 (ja) * 2012-08-31 2017-02-01 古河機械金属株式会社 基板の製造方法
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193091A (en) * 1981-05-22 1982-11-27 Nippon Electric Co Method of forming circuit pattern
JPS60214973A (ja) * 1984-03-23 1985-10-28 Seiko Epson Corp 印写装置

Also Published As

Publication number Publication date
JPS63239895A (ja) 1988-10-05

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