JPS648700A - Manufacture of printed circuit board - Google Patents

Manufacture of printed circuit board

Info

Publication number
JPS648700A
JPS648700A JP16431987A JP16431987A JPS648700A JP S648700 A JPS648700 A JP S648700A JP 16431987 A JP16431987 A JP 16431987A JP 16431987 A JP16431987 A JP 16431987A JP S648700 A JPS648700 A JP S648700A
Authority
JP
Japan
Prior art keywords
thermal transfer
semicured
manufacture
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16431987A
Other languages
Japanese (ja)
Inventor
Sadatoshi Murakami
Hideo Shigesato
Satoru Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16431987A priority Critical patent/JPS648700A/en
Publication of JPS648700A publication Critical patent/JPS648700A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To utilize a computer output for the manufacture of a printed circuit board as it is and to simplify manufacturing steps by transferring a conductive path pattern to an insulating substrate by a thermal transfer printing method using a thermal transfer material made of semicured thermoset synthetic resin containing fine conductive particles. CONSTITUTION:A thermal transfer sheet 1 is formed, for example, of a layer of a thermal transfer material 12 in which a base material 11 of a plastic film, such as polyethylene terephthalate resin is coated with semicured thermoset synthetic resin including fine conductive particles. Then, a thermal head 4 is heated to a predetermined heating point in response to a signal from an exterior controlled by a computer, the predetermined part of the material 12 of semicured state on the sheet 1 is melted by the heat, and transferred onto a transfer medium 2.
JP16431987A 1987-06-30 1987-06-30 Manufacture of printed circuit board Pending JPS648700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16431987A JPS648700A (en) 1987-06-30 1987-06-30 Manufacture of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16431987A JPS648700A (en) 1987-06-30 1987-06-30 Manufacture of printed circuit board

Publications (1)

Publication Number Publication Date
JPS648700A true JPS648700A (en) 1989-01-12

Family

ID=15790893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16431987A Pending JPS648700A (en) 1987-06-30 1987-06-30 Manufacture of printed circuit board

Country Status (1)

Country Link
JP (1) JPS648700A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228095A (en) * 1989-02-28 1990-09-11 Nec Corp Manufacture of multilayer interconnection substrate
JPH0319297A (en) * 1989-06-15 1991-01-28 Nec Corp Manufacture of multilayer ceramic circuit board
CN111688304A (en) * 2019-03-12 2020-09-22 合正科技股份有限公司 Melamine plate for PCB drilling and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141789A (en) * 1979-04-20 1980-11-05 Toppan Printing Co Ltd Conductive resistance film transfer and method of transferring same
JPS56169392A (en) * 1980-05-29 1981-12-26 Nissha Printing Method of producing printed circuit board
JPS6384095A (en) * 1986-09-26 1988-04-14 株式会社島津製作所 Formation of thick film circuit pattern
JPS63239895A (en) * 1986-11-19 1988-10-05 株式会社日立製作所 Method and apparatus for manufacture of printed circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141789A (en) * 1979-04-20 1980-11-05 Toppan Printing Co Ltd Conductive resistance film transfer and method of transferring same
JPS56169392A (en) * 1980-05-29 1981-12-26 Nissha Printing Method of producing printed circuit board
JPS6384095A (en) * 1986-09-26 1988-04-14 株式会社島津製作所 Formation of thick film circuit pattern
JPS63239895A (en) * 1986-11-19 1988-10-05 株式会社日立製作所 Method and apparatus for manufacture of printed circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02228095A (en) * 1989-02-28 1990-09-11 Nec Corp Manufacture of multilayer interconnection substrate
JPH0319297A (en) * 1989-06-15 1991-01-28 Nec Corp Manufacture of multilayer ceramic circuit board
CN111688304A (en) * 2019-03-12 2020-09-22 合正科技股份有限公司 Melamine plate for PCB drilling and manufacturing method thereof

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