JPH0469835B2 - - Google Patents

Info

Publication number
JPH0469835B2
JPH0469835B2 JP62026930A JP2693087A JPH0469835B2 JP H0469835 B2 JPH0469835 B2 JP H0469835B2 JP 62026930 A JP62026930 A JP 62026930A JP 2693087 A JP2693087 A JP 2693087A JP H0469835 B2 JPH0469835 B2 JP H0469835B2
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit board
reversing
injection
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62026930A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63194393A (ja
Inventor
Hiroshi Hoshimi
Hitoshi Nakatsubo
Hitoshi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DENSHI GIKEN KK
Original Assignee
DENSHI GIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DENSHI GIKEN KK filed Critical DENSHI GIKEN KK
Priority to JP2693087A priority Critical patent/JPS63194393A/ja
Publication of JPS63194393A publication Critical patent/JPS63194393A/ja
Publication of JPH0469835B2 publication Critical patent/JPH0469835B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2693087A 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置 Granted JPS63194393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2693087A JPS63194393A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2693087A JPS63194393A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Publications (2)

Publication Number Publication Date
JPS63194393A JPS63194393A (ja) 1988-08-11
JPH0469835B2 true JPH0469835B2 (enExample) 1992-11-09

Family

ID=12206879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2693087A Granted JPS63194393A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Country Status (1)

Country Link
JP (1) JPS63194393A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770822B2 (ja) * 1989-03-30 1995-07-31 トリニティ工業株式会社 ソルダーレジストの塗布方法
JPH02257697A (ja) * 1989-03-30 1990-10-18 Trinity Ind Corp ソルダーレジストの塗布方法
JP2013143563A (ja) * 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014517B2 (ja) * 1980-08-19 1985-04-13 ノ−ドソン株式会社 発泡型ホットメルトによって互いに固定されている電子部品と配線基板及びそれらの固定方法
JPS59214293A (ja) * 1983-05-20 1984-12-04 三菱電機株式会社 半導体装置用印刷装置
JPS6034093A (ja) * 1983-08-05 1985-02-21 株式会社日立製作所 プリント回路板への液体ワニスの塗布方法

Also Published As

Publication number Publication date
JPS63194393A (ja) 1988-08-11

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