JPH0455552B2 - - Google Patents

Info

Publication number
JPH0455552B2
JPH0455552B2 JP62026929A JP2692987A JPH0455552B2 JP H0455552 B2 JPH0455552 B2 JP H0455552B2 JP 62026929 A JP62026929 A JP 62026929A JP 2692987 A JP2692987 A JP 2692987A JP H0455552 B2 JPH0455552 B2 JP H0455552B2
Authority
JP
Japan
Prior art keywords
circuit board
electronic circuit
film
resin
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62026929A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63194392A (ja
Inventor
Hiroshi Hoshimi
Hitoshi Nakatsubo
Hitoshi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DENSHI GIKEN KK
Original Assignee
DENSHI GIKEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DENSHI GIKEN KK filed Critical DENSHI GIKEN KK
Priority to JP2692987A priority Critical patent/JPS63194392A/ja
Publication of JPS63194392A publication Critical patent/JPS63194392A/ja
Publication of JPH0455552B2 publication Critical patent/JPH0455552B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2692987A 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置 Granted JPS63194392A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2692987A JPS63194392A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2692987A JPS63194392A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Publications (2)

Publication Number Publication Date
JPS63194392A JPS63194392A (ja) 1988-08-11
JPH0455552B2 true JPH0455552B2 (enExample) 1992-09-03

Family

ID=12206854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2692987A Granted JPS63194392A (ja) 1987-02-07 1987-02-07 電子回路基板の被膜形成方法及び装置

Country Status (1)

Country Link
JP (1) JPS63194392A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014517B2 (ja) * 1980-08-19 1985-04-13 ノ−ドソン株式会社 発泡型ホットメルトによって互いに固定されている電子部品と配線基板及びそれらの固定方法
JPS6034093A (ja) * 1983-08-05 1985-02-21 株式会社日立製作所 プリント回路板への液体ワニスの塗布方法

Also Published As

Publication number Publication date
JPS63194392A (ja) 1988-08-11

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