JPH046907Y2 - - Google Patents
Info
- Publication number
- JPH046907Y2 JPH046907Y2 JP1986011143U JP1114386U JPH046907Y2 JP H046907 Y2 JPH046907 Y2 JP H046907Y2 JP 1986011143 U JP1986011143 U JP 1986011143U JP 1114386 U JP1114386 U JP 1114386U JP H046907 Y2 JPH046907 Y2 JP H046907Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- motherboard substrate
- sintered body
- ceramic sintered
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 25
- 239000002131 composite material Substances 0.000 claims description 21
- 239000011148 porous material Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910011255 B2O3 Inorganic materials 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000007849 furan resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 24
- 239000000843 powder Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- HDNHWROHHSBKJG-UHFFFAOYSA-N formaldehyde;furan-2-ylmethanol Chemical compound O=C.OCC1=CC=CO1 HDNHWROHHSBKJG-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986011143U JPH046907Y2 (ko) | 1986-01-29 | 1986-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986011143U JPH046907Y2 (ko) | 1986-01-29 | 1986-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62123924U JPS62123924U (ko) | 1987-08-06 |
| JPH046907Y2 true JPH046907Y2 (ko) | 1992-02-25 |
Family
ID=30798089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986011143U Expired JPH046907Y2 (ko) | 1986-01-29 | 1986-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046907Y2 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1287694C (en) * | 1988-08-01 | 1991-08-13 | Ronald S. Charsky | Composite dielectric structure for optimizing electrical performance in highperformance chip support packages |
| JP2787953B2 (ja) * | 1989-08-03 | 1998-08-20 | イビデン株式会社 | 電子回路基板 |
| US6778398B2 (en) * | 2002-10-24 | 2004-08-17 | Koninklijke Philips Electronics N.V. | Thermal-conductive substrate package |
| JP4661196B2 (ja) * | 2004-07-27 | 2011-03-30 | 日立化成工業株式会社 | 低誘電率絶縁性樹脂組成物 |
| JP4691921B2 (ja) * | 2004-07-27 | 2011-06-01 | 日立化成工業株式会社 | 樹脂用特性調整剤及びそれを用いた特性調整化樹脂組成物 |
| JP2015088752A (ja) * | 2013-10-28 | 2015-05-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | コア基板及びコア基板の製造方法 |
| JP6189822B2 (ja) * | 2014-11-28 | 2017-08-30 | デンカ株式会社 | 窒化ホウ素樹脂複合体回路基板 |
| JP6170486B2 (ja) * | 2014-12-05 | 2017-07-26 | デンカ株式会社 | セラミックス樹脂複合体回路基板及びそれを用いたパワー半導体モジュール |
| JP7458479B2 (ja) * | 2020-05-15 | 2024-03-29 | デンカ株式会社 | 複合体及び複合体の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837405A (ko) * | 1971-09-14 | 1973-06-02 | ||
| JPS5373365A (en) * | 1976-12-10 | 1978-06-29 | Ibm | Method of producing multilayer ceramic board |
-
1986
- 1986-01-29 JP JP1986011143U patent/JPH046907Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837405A (ko) * | 1971-09-14 | 1973-06-02 | ||
| JPS5373365A (en) * | 1976-12-10 | 1978-06-29 | Ibm | Method of producing multilayer ceramic board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62123924U (ko) | 1987-08-06 |
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