JPH0467339B2 - - Google Patents

Info

Publication number
JPH0467339B2
JPH0467339B2 JP59118954A JP11895484A JPH0467339B2 JP H0467339 B2 JPH0467339 B2 JP H0467339B2 JP 59118954 A JP59118954 A JP 59118954A JP 11895484 A JP11895484 A JP 11895484A JP H0467339 B2 JPH0467339 B2 JP H0467339B2
Authority
JP
Japan
Prior art keywords
glass sleeve
slag
glass
sleeve
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59118954A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60262447A (ja
Inventor
Kensuke Suzuki
Mitsusachi Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59118954A priority Critical patent/JPS60262447A/ja
Publication of JPS60262447A publication Critical patent/JPS60262447A/ja
Publication of JPH0467339B2 publication Critical patent/JPH0467339B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59118954A 1984-06-08 1984-06-08 ガラススリ−ブ形半導体装置 Granted JPS60262447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59118954A JPS60262447A (ja) 1984-06-08 1984-06-08 ガラススリ−ブ形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59118954A JPS60262447A (ja) 1984-06-08 1984-06-08 ガラススリ−ブ形半導体装置

Publications (2)

Publication Number Publication Date
JPS60262447A JPS60262447A (ja) 1985-12-25
JPH0467339B2 true JPH0467339B2 (enrdf_load_stackoverflow) 1992-10-28

Family

ID=14749372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59118954A Granted JPS60262447A (ja) 1984-06-08 1984-06-08 ガラススリ−ブ形半導体装置

Country Status (1)

Country Link
JP (1) JPS60262447A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS60262447A (ja) 1985-12-25

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