JPS6255705B2 - - Google Patents
Info
- Publication number
- JPS6255705B2 JPS6255705B2 JP55005775A JP577580A JPS6255705B2 JP S6255705 B2 JPS6255705 B2 JP S6255705B2 JP 55005775 A JP55005775 A JP 55005775A JP 577580 A JP577580 A JP 577580A JP S6255705 B2 JPS6255705 B2 JP S6255705B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- glass sleeve
- pair
- semiconductor device
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP577580A JPS56104463A (en) | 1980-01-23 | 1980-01-23 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP577580A JPS56104463A (en) | 1980-01-23 | 1980-01-23 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56104463A JPS56104463A (en) | 1981-08-20 |
JPS6255705B2 true JPS6255705B2 (enrdf_load_stackoverflow) | 1987-11-20 |
Family
ID=11620484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP577580A Granted JPS56104463A (en) | 1980-01-23 | 1980-01-23 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56104463A (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS553259B2 (enrdf_load_stackoverflow) * | 1972-08-10 | 1980-01-24 | ||
JPS5336496B2 (enrdf_load_stackoverflow) * | 1973-03-16 | 1978-10-03 | ||
JPS5317070A (en) * | 1976-07-30 | 1978-02-16 | Nec Corp | Semiconductor device |
-
1980
- 1980-01-23 JP JP577580A patent/JPS56104463A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56104463A (en) | 1981-08-20 |
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