JPH0465890B2 - - Google Patents

Info

Publication number
JPH0465890B2
JPH0465890B2 JP60238053A JP23805385A JPH0465890B2 JP H0465890 B2 JPH0465890 B2 JP H0465890B2 JP 60238053 A JP60238053 A JP 60238053A JP 23805385 A JP23805385 A JP 23805385A JP H0465890 B2 JPH0465890 B2 JP H0465890B2
Authority
JP
Japan
Prior art keywords
lead frame
alloy
copper
frame material
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60238053A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6299431A (ja
Inventor
Kenji Kubozono
Kimio Hashizume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23805385A priority Critical patent/JPS6299431A/ja
Publication of JPS6299431A publication Critical patent/JPS6299431A/ja
Publication of JPH0465890B2 publication Critical patent/JPH0465890B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP23805385A 1985-10-24 1985-10-24 半導体装置用リードフレーム材 Granted JPS6299431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23805385A JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23805385A JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Publications (2)

Publication Number Publication Date
JPS6299431A JPS6299431A (ja) 1987-05-08
JPH0465890B2 true JPH0465890B2 (enExample) 1992-10-21

Family

ID=17024462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23805385A Granted JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Country Status (1)

Country Link
JP (1) JPS6299431A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529489B2 (ja) * 1991-07-09 1996-08-28 三菱電機株式会社 銅−ニッケル基合金
JP4568092B2 (ja) * 2004-11-17 2010-10-27 Ｄｏｗａホールディングス株式会社 Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270540A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材

Also Published As

Publication number Publication date
JPS6299431A (ja) 1987-05-08

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