JPS6299431A - 半導体装置用リードフレーム材 - Google Patents

半導体装置用リードフレーム材

Info

Publication number
JPS6299431A
JPS6299431A JP23805385A JP23805385A JPS6299431A JP S6299431 A JPS6299431 A JP S6299431A JP 23805385 A JP23805385 A JP 23805385A JP 23805385 A JP23805385 A JP 23805385A JP S6299431 A JPS6299431 A JP S6299431A
Authority
JP
Japan
Prior art keywords
alloy
copper
semiconductor devices
lead frame
frame material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23805385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465890B2 (enExample
Inventor
Kenji Kubozono
久保薗　健治
Kimio Hashizume
橋爪　公男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23805385A priority Critical patent/JPS6299431A/ja
Publication of JPS6299431A publication Critical patent/JPS6299431A/ja
Publication of JPH0465890B2 publication Critical patent/JPH0465890B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP23805385A 1985-10-24 1985-10-24 半導体装置用リードフレーム材 Granted JPS6299431A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23805385A JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23805385A JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Publications (2)

Publication Number Publication Date
JPS6299431A true JPS6299431A (ja) 1987-05-08
JPH0465890B2 JPH0465890B2 (enExample) 1992-10-21

Family

ID=17024462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23805385A Granted JPS6299431A (ja) 1985-10-24 1985-10-24 半導体装置用リードフレーム材

Country Status (1)

Country Link
JP (1) JPS6299431A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059628A (ja) * 1991-07-09 1993-01-19 Mitsubishi Electric Corp 銅−ニツケル基合金
JP2006144047A (ja) * 2004-11-17 2006-06-08 Dowa Mining Co Ltd Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270540A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270540A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059628A (ja) * 1991-07-09 1993-01-19 Mitsubishi Electric Corp 銅−ニツケル基合金
JP2006144047A (ja) * 2004-11-17 2006-06-08 Dowa Mining Co Ltd Ｃｕ−Ｎｉ−Ｔｉ系銅合金および放熱板

Also Published As

Publication number Publication date
JPH0465890B2 (enExample) 1992-10-21

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