JPH046476B2 - - Google Patents
Info
- Publication number
- JPH046476B2 JPH046476B2 JP63141586A JP14158688A JPH046476B2 JP H046476 B2 JPH046476 B2 JP H046476B2 JP 63141586 A JP63141586 A JP 63141586A JP 14158688 A JP14158688 A JP 14158688A JP H046476 B2 JPH046476 B2 JP H046476B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- silver
- brazing filler
- test
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14158688A JPH01313198A (ja) | 1988-06-10 | 1988-06-10 | 低融点低銀ろう材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14158688A JPH01313198A (ja) | 1988-06-10 | 1988-06-10 | 低融点低銀ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01313198A JPH01313198A (ja) | 1989-12-18 |
JPH046476B2 true JPH046476B2 (enrdf_load_stackoverflow) | 1992-02-05 |
Family
ID=15295450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14158688A Granted JPH01313198A (ja) | 1988-06-10 | 1988-06-10 | 低融点低銀ろう材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01313198A (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3232963B2 (ja) * | 1994-10-11 | 2001-11-26 | 株式会社日立製作所 | 有機基板接続用鉛レスはんだ及びそれを用いた実装品 |
JP5242952B2 (ja) * | 2007-06-27 | 2013-07-24 | 日本特殊陶業株式会社 | 固体電解質形燃料電池及びその製造方法 |
CN101985193B (zh) * | 2010-11-18 | 2012-09-05 | 常熟市华银焊料有限公司 | 无镉银钎料及其制备方法 |
JP5432231B2 (ja) * | 2011-11-21 | 2014-03-05 | 日本特殊陶業株式会社 | 固体電解質形燃料電池用接合部材 |
EP2832488A1 (en) * | 2013-07-31 | 2015-02-04 | Umicore AG & Co. KG | Brazing alloys |
CN107478799B (zh) * | 2017-08-24 | 2019-07-16 | 华北水利水电大学 | 一种预测低熔点元素调控钎焊接头力学性能的方法 |
CN107505445B (zh) * | 2017-08-24 | 2020-01-10 | 华北水利水电大学 | 一种低熔点元素调控银基钎料钎焊接头力学性能的预测方法 |
KR102426529B1 (ko) | 2018-04-23 | 2022-07-29 | 다나카 기킨조쿠 고교 가부시키가이샤 | 은납재 및 해당 은납재를 사용한 접합 방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50136254A (enrdf_load_stackoverflow) * | 1974-04-18 | 1975-10-29 | ||
JPH0615115B2 (ja) * | 1985-04-22 | 1994-03-02 | 株式会社徳力本店 | 銀ろう材 |
-
1988
- 1988-06-10 JP JP14158688A patent/JPH01313198A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01313198A (ja) | 1989-12-18 |
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