JPH01313198A - 低融点低銀ろう材 - Google Patents

低融点低銀ろう材

Info

Publication number
JPH01313198A
JPH01313198A JP14158688A JP14158688A JPH01313198A JP H01313198 A JPH01313198 A JP H01313198A JP 14158688 A JP14158688 A JP 14158688A JP 14158688 A JP14158688 A JP 14158688A JP H01313198 A JPH01313198 A JP H01313198A
Authority
JP
Japan
Prior art keywords
filler metal
brazing filler
brazing
silver
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14158688A
Other languages
English (en)
Japanese (ja)
Other versions
JPH046476B2 (enrdf_load_stackoverflow
Inventor
Itaru Tamura
至 田村
Kazuo Akazawa
赤沢 和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Steel Mfg Co Ltd
Original Assignee
Mitsubishi Steel Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Steel Mfg Co Ltd filed Critical Mitsubishi Steel Mfg Co Ltd
Priority to JP14158688A priority Critical patent/JPH01313198A/ja
Publication of JPH01313198A publication Critical patent/JPH01313198A/ja
Publication of JPH046476B2 publication Critical patent/JPH046476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
JP14158688A 1988-06-10 1988-06-10 低融点低銀ろう材 Granted JPH01313198A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14158688A JPH01313198A (ja) 1988-06-10 1988-06-10 低融点低銀ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14158688A JPH01313198A (ja) 1988-06-10 1988-06-10 低融点低銀ろう材

Publications (2)

Publication Number Publication Date
JPH01313198A true JPH01313198A (ja) 1989-12-18
JPH046476B2 JPH046476B2 (enrdf_load_stackoverflow) 1992-02-05

Family

ID=15295450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14158688A Granted JPH01313198A (ja) 1988-06-10 1988-06-10 低融点低銀ろう材

Country Status (1)

Country Link
JP (1) JPH01313198A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1067929C (zh) * 1994-10-11 2001-07-04 株式会社日立制作所 用于将电子元件连接在有机基底上的无铅焊料及其应用
JP2009009802A (ja) * 2007-06-27 2009-01-15 Ngk Spark Plug Co Ltd 固体電解質形燃料電池及びその製造方法
CN101985193A (zh) * 2010-11-18 2011-03-16 常熟市华银焊料有限公司 无镉银钎料及其制备方法
JP2012109247A (ja) * 2011-11-21 2012-06-07 Ngk Spark Plug Co Ltd 固体電解質形燃料電池用接合部材
JP2016532560A (ja) * 2013-07-31 2016-10-20 ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフトUmicore AG & Co.KG ろう付け合金
CN107478799A (zh) * 2017-08-24 2017-12-15 华北水利水电大学 一种预测低熔点元素调控钎焊接头力学性能的方法
CN107505445A (zh) * 2017-08-24 2017-12-22 华北水利水电大学 一种低熔点元素调控银基钎料钎焊接头力学性能的预测方法
WO2019207823A1 (ja) 2018-04-23 2019-10-31 田中貴金属工業株式会社 銀ろう材及び該銀ろう材を用いた接合方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136254A (enrdf_load_stackoverflow) * 1974-04-18 1975-10-29
JPS61242787A (ja) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd 銀ろう材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136254A (enrdf_load_stackoverflow) * 1974-04-18 1975-10-29
JPS61242787A (ja) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd 銀ろう材

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1067929C (zh) * 1994-10-11 2001-07-04 株式会社日立制作所 用于将电子元件连接在有机基底上的无铅焊料及其应用
JP2009009802A (ja) * 2007-06-27 2009-01-15 Ngk Spark Plug Co Ltd 固体電解質形燃料電池及びその製造方法
CN101985193A (zh) * 2010-11-18 2011-03-16 常熟市华银焊料有限公司 无镉银钎料及其制备方法
CN101985193B (zh) 2010-11-18 2012-09-05 常熟市华银焊料有限公司 无镉银钎料及其制备方法
JP2012109247A (ja) * 2011-11-21 2012-06-07 Ngk Spark Plug Co Ltd 固体電解質形燃料電池用接合部材
JP2016532560A (ja) * 2013-07-31 2016-10-20 ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフトUmicore AG & Co.KG ろう付け合金
CN107478799A (zh) * 2017-08-24 2017-12-15 华北水利水电大学 一种预测低熔点元素调控钎焊接头力学性能的方法
CN107505445A (zh) * 2017-08-24 2017-12-22 华北水利水电大学 一种低熔点元素调控银基钎料钎焊接头力学性能的预测方法
CN107505445B (zh) * 2017-08-24 2020-01-10 华北水利水电大学 一种低熔点元素调控银基钎料钎焊接头力学性能的预测方法
WO2019207823A1 (ja) 2018-04-23 2019-10-31 田中貴金属工業株式会社 銀ろう材及び該銀ろう材を用いた接合方法
KR20200140906A (ko) 2018-04-23 2020-12-16 다나카 기킨조쿠 고교 가부시키가이샤 은납재 및 해당 은납재를 사용한 접합 방법
US11638973B2 (en) 2018-04-23 2023-05-02 Tanaka Kikinzoku Kogyo K.K. Silver brazing material and joining method using the silver brazing material

Also Published As

Publication number Publication date
JPH046476B2 (enrdf_load_stackoverflow) 1992-02-05

Similar Documents

Publication Publication Date Title
US6488888B2 (en) Lead-free solder alloys
US6299835B1 (en) Cadmium-free silver alloy as low-melting brazing filler material
US6156132A (en) Solder alloys
KR101231550B1 (ko) 은납 브레이징 합금
KR19980068127A (ko) 납땜용 무연 합금
US4447391A (en) Brazing alloy containing reactive metals, precious metals, boron and nickel
JP3353662B2 (ja) はんだ合金
JP3262113B2 (ja) はんだ合金
JP3064042B2 (ja) 銀ロウ材
MXPA04005835A (es) Soldadura blanda sin plomo.
US3733687A (en) Method of soldering an aluminum metal to an aluminum or another metal
JP3045453B2 (ja) 高強度半田合金
JPH01313198A (ja) 低融点低銀ろう材
JPH10193169A (ja) 無鉛はんだ合金
JP3386009B2 (ja) はんだ合金
JP2001287082A (ja) はんだ合金
JPH0994688A (ja) 鉛フリーはんだ合金
US2306667A (en) Alloy
JPS63154290A (ja) 低融点低銀ろう材
JP2910527B2 (ja) 高温はんだ
US3356494A (en) Fluxless aluminum brazing alloys
JPH0357588A (ja) アルミニウム合金ろう材
US1699761A (en) Solder
JPS6393496A (ja) 銅基ろう接合金
JPH09285888A (ja) ステンレス鋼用ろう材