US2306667A - Alloy - Google Patents

Alloy Download PDF

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Publication number
US2306667A
US2306667A US430805A US43080542A US2306667A US 2306667 A US2306667 A US 2306667A US 430805 A US430805 A US 430805A US 43080542 A US43080542 A US 43080542A US 2306667 A US2306667 A US 2306667A
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US
United States
Prior art keywords
lead
silver
tin
alloy
solders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US430805A
Inventor
Jr Albert A Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Smelting and Refining Co
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American Smelting and Refining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by American Smelting and Refining Co filed Critical American Smelting and Refining Co
Priority to US430805A priority Critical patent/US2306667A/en
Application granted granted Critical
Publication of US2306667A publication Critical patent/US2306667A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268Pb as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C11/00Alloys based on lead
    • C22C11/06Alloys based on lead with tin as the next major constituent

Definitions

  • This invention relates to lead alloys and more particularly to lead-tin-silver alloys. products of the invention are especially useful as solders but may be utilized for other purposes where it is desired to employ a metal having the physical characteristics of the lead alloys as hereinafter described. 1
  • Lead-silver solders have been known for many years but, because of their relatively high melting temperatures and poor spreading properties, they have not been extensively used. I have discovered, however, that by alloying tin with the lead-silver alloys the aforementioned disadvantages are substantially overcome while certain beneficial properties of the binary alloy are retained.
  • the present invention or di s.
  • covery may be said to provide a ternary alloy of tageous physical properties.
  • the alloy One of the unexpected improvements resulting from the introduction of silver in lead-tin solders is manifested by the increased resistance to creep, as shown in the table.' Further, with the addition of a relative small amount of silver, the tin content can be materially lowered without producing adverse effects. This is of great importance where it is desired to use a minimum content of tin.
  • the preferred lead-tin-silver alloy compositions of my invention are shown in the table. In general, however, the alloy compositions may comprise from 5% to 40% tin, 0.5% to 5.0% silver with the balance lead. Small amounts of antimony, i. e. from 0.25% to 3% may be present or added, particularly where a high tensile strength alloy is desired.
  • the ternary alloys of lead-tin-silver offer a variety of solders which have somewhat higher melting points than the ordinary 40-60 (Sn-Pb) solder but exhibit good spreadingand bond strength properties. Silver added to low-tin solders decrease the liquidus temperature from 6 to 8 C. and markedly improves the spreading properties without appreciably affecting the bond strength.

Description

Patented Dec. 29; 1942 ALLOY Albert A. Smith, Jr., Metuchen, N. J., assignor to American smelting and Refining Company, New York, N. Y., a corporation of New Jersey No Drawing. Application February 13, 1942, Serial No. 430,805
2 Claims.
This invention relates to lead alloys and more particularly to lead-tin-silver alloys. products of the invention are especially useful as solders but may be utilized for other purposes where it is desired to employ a metal having the physical characteristics of the lead alloys as hereinafter described. 1
Lead-silver solders have been known for many years but, because of their relatively high melting temperatures and poor spreading properties, they have not been extensively used. I have discovered, however, that by alloying tin with the lead-silver alloys the aforementioned disadvantages are substantially overcome while certain beneficial properties of the binary alloy are retained.
Broadly speaking, the present invention or di s.
, covery may be said to provide a ternary alloy of tageous physical properties.
lead, tin and silver having certain highly advan- In the following table there is listed some of the significant physical characteristics of these alloys which have been determined. For comparison, corresponding test values are shown for some conventional tin-lead and silver-lead solders. Carefully standardized testing technique was employed in each instance to obtain the comparative test results shown:
The alloy One of the unexpected improvements resulting from the introduction of silver in lead-tin solders is manifested by the increased resistance to creep, as shown in the table.' Further, with the addition of a relative small amount of silver, the tin content can be materially lowered without producing adverse effects. This is of great importance where it is desired to use a minimum content of tin. The preferred lead-tin-silver alloy compositions of my invention are shown in the table. In general, however, the alloy compositions may comprise from 5% to 40% tin, 0.5% to 5.0% silver with the balance lead. Small amounts of antimony, i. e. from 0.25% to 3% may be present or added, particularly where a high tensile strength alloy is desired.
From the data given, it will be appreciated that the ternary alloys of this invention possess and exhibit properties which make them suitable for various uses other than solders, and such other uses are intended to come within the scope of my invention as defined by the appended claims.
What is claimed is:
l. A relatively low melting point alloy composition having high tensile strength and resistance to creep which consists principally of lead, tin and silver, said constituents approximating from 5% TABLE Some properties of soft solders v Creep rate in per cent per year Com sition 1: cent Bond P W Licguidus s'llensilli1 strength Sfpread at C.
' O. g of lapped 3 g Pb Sn Ag 200 psi 400 psi 600 psi 800 psi 60 238 6660 6270 1. 30 10. 9 92 300 97. 5 2. 5 304 4980 3740 0. l9 0. 10 0. l5 0. 50 95 5 375 4015 4340 0. 20 0. 18 0. 22 0. 95 5 312 4800 4000 0.22 92.5 5 2.5 309 4860 4300 0.30 90 10 208 4850 4960 0.27 2.5 87. 75 10 2. 25 1 200 4050 5000 0. 41 2. 3 8. 0 80 20 275 4940 5680 0. 37 6. 7 18. 7 78 20 2 267 5620 5550 0.57 70 30 257 5390 5770 0. 83 69 30 1 1 251 8810 l 5620 0. 86 4 I Determined in this investigation from cooling curves.
Norm-Bond and spread tests were-made on copper sheet. Tensile and creep tests were made on chill cast strips of the alloys.
The ternary alloys of lead-tin-silver offer a variety of solders which have somewhat higher melting points than the ordinary 40-60 (Sn-Pb) solder but exhibit good spreadingand bond strength properties. Silver added to low-tin solders decrease the liquidus temperature from 6 to 8 C. and markedly improves the spreading properties without appreciably affecting the bond strength.
ALBERT A. SMITH, JR.
Disclaimer I Metucheri, N. J. "ALLOY:
2,306,667.Albert A. Smith, J12,
1942. Disclaimer filed Oct. 27, 1949, by the ass and Refining Company.
Hereby enters this [Oifim'fil Gazett disclaimer to claim 2 of said patent. a December 20, 1949.]
gnee, American smelting
US430805A 1942-02-13 1942-02-13 Alloy Expired - Lifetime US2306667A (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2470957A (en) * 1945-08-27 1949-05-24 Battelle Memorial Institute Soft soldering flux
US2623273A (en) * 1945-05-05 1952-12-30 Indium Corp America Soldered joint and method of making same
US2820079A (en) * 1955-12-22 1958-01-14 Gould National Batteries Inc Battery grid alloy
US3355285A (en) * 1965-10-21 1967-11-28 Gen Motors Corp Creep resistant solder alloy
US3768141A (en) * 1972-02-22 1973-10-30 Ford Motor Co Method of soldering
DE2536896A1 (en) * 1974-08-19 1976-03-04 Multicore Solders Ltd PROCEDURE FOR SOLDERING ALUMINUM OR ALUMINUM ALLOYS USING FLUX-SOLVENT COMPOSITIONS AND FLUX-SOLDER COMPOSITIONS FOR USE IN THIS PROCESS
US4517027A (en) * 1980-12-16 1985-05-14 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Bulk production of alloys by deposition from the vapor phase and apparatus therefor
US4608230A (en) * 1985-03-04 1986-08-26 Fry Metals, Inc. Pb-Sn-Sb-Ag solder alloy
US5256370A (en) * 1992-05-04 1993-10-26 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2623273A (en) * 1945-05-05 1952-12-30 Indium Corp America Soldered joint and method of making same
US2470957A (en) * 1945-08-27 1949-05-24 Battelle Memorial Institute Soft soldering flux
US2820079A (en) * 1955-12-22 1958-01-14 Gould National Batteries Inc Battery grid alloy
US3355285A (en) * 1965-10-21 1967-11-28 Gen Motors Corp Creep resistant solder alloy
US3768141A (en) * 1972-02-22 1973-10-30 Ford Motor Co Method of soldering
DE2536896A1 (en) * 1974-08-19 1976-03-04 Multicore Solders Ltd PROCEDURE FOR SOLDERING ALUMINUM OR ALUMINUM ALLOYS USING FLUX-SOLVENT COMPOSITIONS AND FLUX-SOLDER COMPOSITIONS FOR USE IN THIS PROCESS
US4517027A (en) * 1980-12-16 1985-05-14 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Bulk production of alloys by deposition from the vapor phase and apparatus therefor
US4608230A (en) * 1985-03-04 1986-08-26 Fry Metals, Inc. Pb-Sn-Sb-Ag solder alloy
US5256370A (en) * 1992-05-04 1993-10-26 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium
US5580520A (en) * 1992-05-04 1996-12-03 The Indium Corporation Of America Lead-free alloy containing tin, silver and indium

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