JPH0461686B2 - - Google Patents
Info
- Publication number
- JPH0461686B2 JPH0461686B2 JP63238854A JP23885488A JPH0461686B2 JP H0461686 B2 JPH0461686 B2 JP H0461686B2 JP 63238854 A JP63238854 A JP 63238854A JP 23885488 A JP23885488 A JP 23885488A JP H0461686 B2 JPH0461686 B2 JP H0461686B2
- Authority
- JP
- Japan
- Prior art keywords
- absorbent
- exhaust gas
- semiconductor manufacturing
- bypass valve
- exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007789 gas Substances 0.000 claims description 75
- 239000002250 absorbent Substances 0.000 claims description 53
- 230000002745 absorbent Effects 0.000 claims description 52
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000010926 purge Methods 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Treating Waste Gases (AREA)
- Gas Separation By Absorption (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63238854A JPH01281131A (ja) | 1987-09-25 | 1988-09-26 | 半導体製造排ガスの処理方法及びその装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-238859 | 1987-09-25 | ||
| JP23885987 | 1987-09-25 | ||
| JP63238854A JPH01281131A (ja) | 1987-09-25 | 1988-09-26 | 半導体製造排ガスの処理方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01281131A JPH01281131A (ja) | 1989-11-13 |
| JPH0461686B2 true JPH0461686B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Family
ID=26533939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63238854A Granted JPH01281131A (ja) | 1987-09-25 | 1988-09-26 | 半導体製造排ガスの処理方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01281131A (enrdf_load_stackoverflow) |
-
1988
- 1988-09-26 JP JP63238854A patent/JPH01281131A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01281131A (ja) | 1989-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |