JPH046097B2 - - Google Patents
Info
- Publication number
- JPH046097B2 JPH046097B2 JP56062272A JP6227281A JPH046097B2 JP H046097 B2 JPH046097 B2 JP H046097B2 JP 56062272 A JP56062272 A JP 56062272A JP 6227281 A JP6227281 A JP 6227281A JP H046097 B2 JPH046097 B2 JP H046097B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- case
- integrated circuit
- microwave integrated
- foil plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011888 foil Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Waveguides (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56062272A JPS57177544A (en) | 1981-04-24 | 1981-04-24 | Microwave ic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56062272A JPS57177544A (en) | 1981-04-24 | 1981-04-24 | Microwave ic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57177544A JPS57177544A (en) | 1982-11-01 |
| JPH046097B2 true JPH046097B2 (id) | 1992-02-04 |
Family
ID=13195339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56062272A Granted JPS57177544A (en) | 1981-04-24 | 1981-04-24 | Microwave ic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57177544A (id) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4278617B2 (ja) | 2002-11-12 | 2009-06-17 | 富士通株式会社 | 実装構造及び電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5345570U (id) * | 1976-09-22 | 1978-04-18 |
-
1981
- 1981-04-24 JP JP56062272A patent/JPS57177544A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5345570U (id) * | 1976-09-22 | 1978-04-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57177544A (en) | 1982-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4266206A (en) | Stripline filter device | |
| US4949219A (en) | Module sealing structure | |
| US4638938A (en) | Vapor phase bonding for RF microstrip line circuits | |
| JPH046097B2 (id) | ||
| USRE31470E (en) | Stripline filter device | |
| JP2904596B2 (ja) | 基板取付装置 | |
| US3375407A (en) | Electronic mounting unit having spaced plate elements supported in position | |
| JP3448833B2 (ja) | 伝送線路及び半導体装置 | |
| JP2007189062A (ja) | Ｈｐａパッケージ | |
| JPS6083401A (ja) | マイクロ波回路 | |
| JPH07240601A (ja) | 高周波回路基板の接続方法 | |
| JPH07326909A (ja) | マイクロ波整合回路 | |
| KR20000053210A (ko) | 집적 전자 구조 장치 | |
| JPH0117841Y2 (id) | ||
| JPH026441B2 (id) | ||
| JP2758273B2 (ja) | 高周波平面回路モジュールの実装構造 | |
| JPH0812899B2 (ja) | 高周波回路用パツケ−ジ | |
| JPH04212501A (ja) | マイクロストリップラインの接続方法 | |
| JP3199874B2 (ja) | 減衰器 | |
| JP3093599B2 (ja) | マイクロ波回路の実装構造 | |
| JPH01187956A (ja) | 半導体装置用パツケージ | |
| GB2319397A (en) | A mounting structure for a printed circuit board | |
| JPH04109701A (ja) | マイクロ波半導体装置 | |
| JPS59212002A (ja) | マイクロストリツプ線路と立体回路との接続装置 | |
| JPH0389605A (ja) | 高周波増幅回路 |