JPS57177544A - Microwave ic device - Google Patents

Microwave ic device

Info

Publication number
JPS57177544A
JPS57177544A JP56062272A JP6227281A JPS57177544A JP S57177544 A JPS57177544 A JP S57177544A JP 56062272 A JP56062272 A JP 56062272A JP 6227281 A JP6227281 A JP 6227281A JP S57177544 A JPS57177544 A JP S57177544A
Authority
JP
Japan
Prior art keywords
carrier
foil
case
size
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56062272A
Other languages
Japanese (ja)
Other versions
JPH046097B2 (en
Inventor
Tadaaki Kurosaki
Yoichi Kawakami
Tadaoki Kamiu
Seizo Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UCHIYUU KAIHATSU JIGIYOUDAN
National Space Development Agency of Japan
Mitsubishi Electric Corp
Original Assignee
UCHIYUU KAIHATSU JIGIYOUDAN
National Space Development Agency of Japan
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UCHIYUU KAIHATSU JIGIYOUDAN, National Space Development Agency of Japan, Mitsubishi Electric Corp filed Critical UCHIYUU KAIHATSU JIGIYOUDAN
Priority to JP56062272A priority Critical patent/JPS57177544A/en
Publication of JPS57177544A publication Critical patent/JPS57177544A/en
Publication of JPH046097B2 publication Critical patent/JPH046097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Waveguides (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To stabilize performance by a method wherein a Cu foil film smaller than a carrier in size is placed under the carrier and the carrier is screwedly fixed for a constant pressure allowing no changes in the contact (ground) between the carrier and the case. CONSTITUTION:Cu or Al foil 21 is sandwiched between a carrier 2 and a case 3. The Cu foil 21 is different in size from a square ceramic substrate 1 and is positioned about 45 deg. rotated on the ceramic substrate 1. The carrier 2 is fixed by screws to the case 3 and the Cu foil 21 is strongly pressed, especially around the corners 211-214, between the carrier 2 and the case 3. In a microwave IC using this construction, a change in size caused by different expansion factors, of the respective materials constituting the device exposed to a great environmental temperature change, is absorbed by the Cu foil 21. Accordingly, the contact between the carrier and the case remains unaffected and a stable property is expected from the device with its ground points remaining stable.
JP56062272A 1981-04-24 1981-04-24 Microwave ic device Granted JPS57177544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56062272A JPS57177544A (en) 1981-04-24 1981-04-24 Microwave ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56062272A JPS57177544A (en) 1981-04-24 1981-04-24 Microwave ic device

Publications (2)

Publication Number Publication Date
JPS57177544A true JPS57177544A (en) 1982-11-01
JPH046097B2 JPH046097B2 (en) 1992-02-04

Family

ID=13195339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56062272A Granted JPS57177544A (en) 1981-04-24 1981-04-24 Microwave ic device

Country Status (1)

Country Link
JP (1) JPS57177544A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1562230A1 (en) * 2002-11-12 2005-08-10 Fujitsu Limited Packaging structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5345570U (en) * 1976-09-22 1978-04-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5345570U (en) * 1976-09-22 1978-04-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1562230A1 (en) * 2002-11-12 2005-08-10 Fujitsu Limited Packaging structure
US7285429B2 (en) 2002-11-12 2007-10-23 Fujitsu Limited Mounting device for high frequency microwave devices
EP1562230A4 (en) * 2002-11-12 2007-12-05 Fujitsu Ltd Packaging structure
US7729129B2 (en) 2002-11-12 2010-06-01 Fujitsu Limited Mounting device for high frequency microwave devices

Also Published As

Publication number Publication date
JPH046097B2 (en) 1992-02-04

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