GB2319397A - A mounting structure for a printed circuit board - Google Patents

A mounting structure for a printed circuit board Download PDF

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Publication number
GB2319397A
GB2319397A GB9721520A GB9721520A GB2319397A GB 2319397 A GB2319397 A GB 2319397A GB 9721520 A GB9721520 A GB 9721520A GB 9721520 A GB9721520 A GB 9721520A GB 2319397 A GB2319397 A GB 2319397A
Authority
GB
United Kingdom
Prior art keywords
section
printed board
mounting
mounting structure
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9721520A
Other versions
GB9721520D0 (en
GB2319397B (en
Inventor
Hiroto Kinuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9721520D0 publication Critical patent/GB9721520D0/en
Publication of GB2319397A publication Critical patent/GB2319397A/en
Application granted granted Critical
Publication of GB2319397B publication Critical patent/GB2319397B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/04Arrangements of circuit components or wiring on supporting structure on conductive chassis

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A metal housing for a printed circuit board has on its side walls mounting structures (3) which are formed by cutting the structure out of the wall such that the structure has a narrow portion (3a) attached at one end to the wall and a wide portion (3b) attached to the other end of the narrow portion and arranged to be pushed into resilient contact with the wall when the circuit board is mounted in position. The circuit board rests on a retaining section (3c) and may engage with the narrow portion by means of a recess in the periphery of the board (see Fig.1). An aperture (3d) allows a conductive layer at the periphery of the circuit board to be soldered to the structure. Applications include TV equipment.

Description

MOUNTING STRUCTURE FOR PRINTED BOARD The present invention relates to a mounting structure for a printed board which is suited for use in an electronic apparatus such as a television tuner.
In a mounting structure for a printed board to be used in an electronic apparatus of this type, as shown in Figs. 7 to 10, a box-shaped frame 10 formed of a metal plate is provided, on side walls 11, with L-shaped mounting leaves 12 each of which is louvered inward and has a support leaf 12a and a convex section 12b.
The support leaf 12a and the convex section 12b of each mounting leaf 12 are formed, as shown in Fig. 10, by louvering along a louver line E shown in Fig. 9.
Furthermore, a printed board 15 in which a conductive layer 14 is formed on an insulating substrate 13 is provided with holes 13a at the positions opposed to the convex sections 12b.
The convex sections 12b of the mounting leaves 12 are respectively inserted through the holes 13a of the printed board 15, and the lower surface of the printed board 15 is retained by the support leaves 12a of the mounting leaves 12. After that, the convex sections 12b and the conductive layer 14 are joined by solder 16, whereby the printed board 15 is mounted to the frame 10.
Since the printed board 15 is mounted by means of the L-shaped mounting leaves 12 in the conventional printed board mounting structure, when it expands or contracts according to the temperature of the external environment, the mounting leaves 12 do not have any spring, and therefore, cracking may occur to the solder 16 which connects the printed board 15 with the frame 10.
Furthermore, the L-shaped mounting leaves 12 are cantilevered, the inductance thereof increases, which lowers the performance.
Still furthermore, since only the rod-like convex sections 12b are soldered, the soldering strength is weak, and therefore, the applied solder is apt to peel off.
As a first means for solving the above problems, there is provided a mounting structure for a printed board wherein a side plate of a frame formed of a solderable metal plate is provided with a mounting section composed of a narrow section connected at one end to the side plate and a wide section formed at the end of the narrow section, a recessed section formed on a printed board is fitted on the mounting section so that the end of the wide section is brought into contact with the side plate, and a conductive layer formed on the periphery of the recessed section of the printed board is soldered onto the mounting section.
Furthermore, as a second solving means, the mounting section is provided with a louvered retaining section, and the printed board is retained by the retaining section.
Still furthermore, as a third solving means, the wide section of the mounting section is shaped like a trapezoid which has a long side at the end and a short side at a portion connected to the narrow section.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a printed board mounting structure according to an embodiment of the present invention.
Fig. 2 is an enlarged sectional view showing the principal part of the printed board mounting structure according to the embodiment.
Fig. 3 is an explanatory view showing a method of forming the printed board mounting structure according to the embodiment.
Fig. 4 is an enlarged perspective view showing the principal part of the printed board mounting structure according to the embodiment.
Fig. 5 is an explanatory view showing a method of forming a printed board mounting structure according to another embodiment of the present invention.
Fig. 6 is an enlarged perspective view showing the principal part of the printed board mounting structure according to the embodiment.
Fig. 7 is a plan view showing a conventional printed board mounting structure.
Fig. 8 is an enlarged sectional view showing the principal part of the conventional printed board mounting structure.
Fig. 9 is an explanatory view showing a method of forming the conventional printed board mounting structure.
Fig. 10 is an enlarged perspective view showing the principal part of the conventional printed board mounting structure.
A printed board mounting structure according to an embodiment of the present invention will be described with reference to Figs. 1 to 4.
A box-shaped frame 1 of a television tuner or the like which is formed of a solderable metal plate is provided, on side plates 2 thereof, with mounting sections 3 louvered and bent into a dogleg shape to project into the frame 1.
The mounting sections 3 are each composed of a narrow section 3a connected to the side plate 2 at one end, a wide section 3b located at the other end of the narrow section 3a, a retaining section 3c louvered on the narrow section 3a and a cutout section 3d.
The wide section 3b is shaped like a trapezoid, which has a long side at one end and a short side at the end portion connected to the narrow section 3a.
The louvered and bent mounting section 3 is shorter than a hole 2a formed by cutting as shown in Figs. 2 and 4.
As a result, the long end of the wide section 3b is partly opposed to the part of the side plate 2 that is not cut out.
Furthermore, the narrow section 3a, the wide section 3b, the retaining section 3c and the cutout section 3d of the mounting section 3 are formed, as shown in Fig. 4, by louvering along a louver line A for the narrow section 3a and the wide section 3b and a louver line B for the retaining section 3c shown in Fig. 3, and bending.
When the trapezoidal wide section 3b is formed, the cutout hole 2a is gradually narrowed, and the end of the wide section 3b is opposed to a part of the side plate 2 that is not cut out, by slight bending of the mounting section 3, which allows flexibility in the bending degree of the mounting section 3.
A printed board 4 comprises a planar insulating substrate 5, a conductive layer 6 formed on the insulating substrate 5 and recessed sections 7 formed at the side ends of the insulating substrate 5.
The conductive layer 6 is also provided on the peripheries of the recessed sections 7, and electric components such as a resistor or a capacitor are soldered thereon, though not illustrated herein.
Such a printed board 4 is first inserted into the frame 1 so that the recessed sections 7 thereof are respectively matched with the mounting sections 3.
Then, the mounting sections 3 are pressed toward the side plates 2 by the printed board 4, the ends of the wide sections 3b are brought into resilient contact with the respective side plates 2, and the printed board 4 is retained at the lower surface thereof by the retaining sections 3c.
After that, the printed board 4 is mounted to the frame 1 by connecting the conductive layer 5 with the mounting sections 3 by solder 8.
The solder 8 also spreads into the cutout sections 3d defined by forming the retaining sections 3c, whereby high solderability of the printed board 4 is achieved.
Moreover, even if the printed board 4 expands or contracts after soldering, the spring of the mounting sections 3 absorbs the expansion or contraction.
Figs. 5 and 6 illustrate another embodiment of the present invention. Mounting sections 3 in this embodiment are each provided with a narrow section 3a, a wide section 3b, a retaining section 3c and a cutout section 3d similarly to the foregoing embodiment, and each have the same structure as in the foregoing embodiment except in that the wide section 3b is shaped like a rectangle.
The mounting sections 3 are each formed, as shown in Fig. 6, by louvering along a louver line C for the narrow section 3a and the wide section 3b and a louver line D for the retaining section 3c shown in Fig. 5, and bending.
According to the present invention, since the wide sections of the mounting sections are brought into contact with the side plate when the printed board is mounted, the mounting sections can offer spring and thereby absorb the expansion and contraction of the printed board.
Accordingly, it is possible to provide a mounting structure which causes no cracking in the solder for connecting the printed board and the frame.
Since each mounting section is connected to the side plate at one end, and in contact with the side plate at the other end, that is, supported at both ends, it is possible to reduce the inductance thereof to almost half of that of the prior art, and to thereby obtain improved performance.
Furthermore, a cutout section is defined by forming the louvered retaining section, and solder spreads into the cutout section, which makes it possible to increase solderability and to thereby provide a mounting structure without solder peeling.
Still furthermore, since the bending of the mounting section can be made flexible by shaping the wide section of the mounting section like a trapezoid, it is possible to provide a mounting structure suitable in terms of design and manufacture.

Claims (4)

1. A mounting structure for a printed board wherein a side plate of a frame formed of a solderable metal plate is provided with a mounting section composed of a narrow section connected at one end to said side plate and a wide section formed at the other end of said narrow section, a recessed section formed on a printed board is fitted on said mounting section so that the end of said wide section is brought into contact with said side plate, and a conductive layer formed on the periphery of said recessed section of said printed board is soldered onto said mounting section.
2. A mounting structure for a printed board according to Claim 1, wherein said mounting section is provided with a louvered retaining section, and said printed board is retained by said retaining section.
3. A mounting structure for a printed board according to Claim 1 or Claim 2, wherein said wide section of said mounting section is shaped like a trapezoid which has a long side at the end and a short side at a portion connected to said narrow section.
4. A mounting structure for a printed board substantially as hereinbefore described with reference to, and as illustrated by, the accompanying drawings.
GB9721520A 1996-11-08 1997-10-13 A mounting structure for a printed circuit board to frame Expired - Fee Related GB2319397B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31303696A JP3267521B2 (en) 1996-11-08 1996-11-08 PCB mounting structure

Publications (3)

Publication Number Publication Date
GB9721520D0 GB9721520D0 (en) 1997-12-10
GB2319397A true GB2319397A (en) 1998-05-20
GB2319397B GB2319397B (en) 2001-07-11

Family

ID=18036442

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9721520A Expired - Fee Related GB2319397B (en) 1996-11-08 1997-10-13 A mounting structure for a printed circuit board to frame

Country Status (4)

Country Link
JP (1) JP3267521B2 (en)
KR (1) KR100266828B1 (en)
CN (1) CN1087899C (en)
GB (1) GB2319397B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7564699B2 (en) 2004-09-17 2009-07-21 Ntt Docomo, Inc. Planar circuit housing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5014730B2 (en) * 2006-10-13 2012-08-29 日置電機株式会社 Shield case
JP2012009471A (en) * 2010-06-22 2012-01-12 Mitsumi Electric Co Ltd High-frequency device and printed board holding structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2029645A (en) * 1978-08-07 1980-03-19 Mitsumi Electric Co Ltd High-frequency circuit device
GB2311416A (en) * 1996-03-18 1997-09-24 Alps Electric Co Ltd Fixing structure for a printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2029645A (en) * 1978-08-07 1980-03-19 Mitsumi Electric Co Ltd High-frequency circuit device
GB2311416A (en) * 1996-03-18 1997-09-24 Alps Electric Co Ltd Fixing structure for a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7564699B2 (en) 2004-09-17 2009-07-21 Ntt Docomo, Inc. Planar circuit housing

Also Published As

Publication number Publication date
JPH10145058A (en) 1998-05-29
CN1087899C (en) 2002-07-17
CN1182347A (en) 1998-05-20
KR100266828B1 (en) 2000-09-15
JP3267521B2 (en) 2002-03-18
GB9721520D0 (en) 1997-12-10
KR19980042181A (en) 1998-08-17
GB2319397B (en) 2001-07-11
MX9708623A (en) 1998-09-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20051013