JP3267521B2 - PCB mounting structure - Google Patents
PCB mounting structureInfo
- Publication number
- JP3267521B2 JP3267521B2 JP31303696A JP31303696A JP3267521B2 JP 3267521 B2 JP3267521 B2 JP 3267521B2 JP 31303696 A JP31303696 A JP 31303696A JP 31303696 A JP31303696 A JP 31303696A JP 3267521 B2 JP3267521 B2 JP 3267521B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- printed circuit
- circuit board
- mounting structure
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、テレビジョンチュ
ーナ等の電子機器に使用して好適なプリント基板の取付
構造に関する。The present invention relates to a printed circuit board mounting structure suitable for use in electronic equipment such as a television tuner.
【０００２】[0002]
【従来の技術】従来、この種の電子機器に使用されるプ
リント基板の取付構造は、図７ー図１０に示すように、
金属板から成る箱形の枠体１０は、その側板１１に、内
方に切り起こしされて形成され、支持片１２ａと凸部１
２ｂとを有するＬ字状の取付片１２が設けられている。
そして、この取付片１２の形成方法は、図９に示す切り
起こし線Ｅに沿って、図１０に示すように切り起こされ
て、支持片１２ａと凸部１２ｂとを形成するものであ
る。また、絶縁基板１３上に導電層１４を形成して成る
プリント基板１５には、前記凸部１２ｂと対向する位置
に孔１３ａが設けられている。そして、このプリント基
板１５は、その孔１３ａに、取付片１２の凸部１２ｂを
挿通して、プリント基板１５の下面を取付辺１２の支持
片１２ａによって係止し、しかる後、凸部１２ｂと導電
層１４とを半田付け１６して、プリント基板１５が枠体
１０に取り付けられる。2. Description of the Related Art Conventionally, a mounting structure of a printed circuit board used for this kind of electronic equipment is as shown in FIGS.
A box-shaped frame 10 made of a metal plate is formed by cutting and raising inward on a side plate 11, and a support piece 12 a and a projection 1 are formed.
2b are provided.
In the method of forming the attachment piece 12, the support piece 12a and the protrusion 12b are formed by cutting and raising the cut piece along the cut and raised line E shown in FIG. 9 as shown in FIG. Further, a hole 13a is provided at a position facing the convex portion 12b on a printed board 15 formed by forming a conductive layer 14 on an insulating substrate 13. Then, the printed board 15 is inserted into the hole 13a through the convex portion 12b of the mounting piece 12, and the lower surface of the printed board 15 is locked by the supporting piece 12a of the mounting side 12. The printed circuit board 15 is attached to the frame 10 by soldering 16 with the conductive layer 14.
【０００３】[0003]
【発明が解決しようとする課題】従来におけるプリント
基板の取付構造は、Ｌ字状の取付片１２によって、プリ
ント基板１５を取り付けるものであるため、プリント基
板１５が外部環境の温度によって伸縮した時、取付片１
２にバネ性がなく、プリント基板１５に割れが生じると
言う問題がある。また、Ｌ字状の取付片１２による片側
支持であるため、取付片１２のインダクタンスが大きく
なり、性能を悪くすると言う問題があった。更に、棒状
の一個の凸部１２ｂが半田付けされる構成であるため、
半田付けの強度が弱く、剥がれやすいと言う問題があ
る。In the conventional mounting structure of a printed circuit board, a printed circuit board 15 is mounted by means of an L-shaped mounting piece 12, so that when the printed circuit board 15 expands and contracts due to the temperature of the external environment. Mounting piece 1
2 has no spring property, and there is a problem that the printed board 15 is cracked. In addition, since the mounting piece 12 is supported on one side by the L-shaped mounting piece 12, there is a problem that the inductance of the mounting piece 12 increases and the performance deteriorates. Furthermore, since one bar-shaped projection 12b is soldered,
There is a problem that the strength of the soldering is weak and the solder is easily peeled off.
【０００４】[0004]
【課題を解決するための手段】前記課題を解決するため
の第１の解決手段として、半田付け可能な金属板から成
る枠体の側板に、一端が前記側板に繋がった細幅部と、
該細幅部の端部に設けられた広幅部とから成る取付部を
形成し、プリント基板に設けた凹部を前記取付部にはめ
合わせ、前記広幅部の端部を前記側板に当接させると共
に、前記プリント基板の凹部の周辺に設けた導電層を、
前記取付部に半田付けした構成とした。また、第２の解
決手段として、前記取付部に、切り起こしされた係止部
を設け、該係止部によって前記プリント基板を掛け止め
した構成とした。更に、第３の解決手段として、前記取
付部の広幅部を、その端部が長辺で、前記細幅部との結
合部が短辺の台形状とした構成とした。As a first means for solving the above-mentioned problems, a narrow plate having one end connected to the side plate is provided on a side plate of a frame made of a solderable metal plate.
Forming a mounting portion comprising a wide portion provided at an end of the narrow portion, fitting a concave portion provided on a printed board to the mounting portion, and bringing an end of the wide portion into contact with the side plate; A conductive layer provided around the concave portion of the printed board,
It was configured to be soldered to the mounting portion. Further, as a second solution, a cut-and-raised locking portion is provided in the mounting portion, and the printed board is hung by the locking portion. Further, as a third solution, the wide portion of the mounting portion has a trapezoidal shape in which the end portion has a long side and the connecting portion with the narrow portion is a short side.
【０００５】[0005]
【発明の実施の形態】本発明におけるプリント基板の取
付構造の一実施例を、図１ー図４に基づいて説明する。
半田付け可能な金属板から成る箱形のテレビジョンチュ
ーナ等の枠体１は、その側板２に、枠体１の内方に突出
するように、切り起こされると共に折り曲げされたく字
状の取付部３が形成されている。この取付部３は、一端
が側板２に繋がった細幅部３ａと、細幅部３ａの端部に
設けられた広幅部３ｂと、細幅部３ａに切り起こしされ
て設けられた係止部３ｃ、及び切り欠き部３ｄとを備え
ている。また、広幅部３ｂは、その端部が長辺で、細幅
部３ａとの結合部が短辺の台形状をなしている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a printed circuit board mounting structure according to the present invention will be described with reference to FIGS.
A frame 1 such as a box-shaped television tuner made of a metal plate that can be soldered is provided on its side plate 2 so as to protrude inward from the frame 1 and cut and raised and bent in a rectangular shape. 3 are formed. The mounting portion 3 has a narrow portion 3a having one end connected to the side plate 2, a wide portion 3b provided at an end of the narrow portion 3a, and a locking portion cut and raised by the narrow portion 3a. 3c and a notch 3d. Further, the wide portion 3b has a trapezoidal shape in which the end portion has a long side and the connection portion with the narrow portion 3a has a short side.
【０００６】そして、切り起こしされて折り曲げされた
取付部３は、図２、図４に示すように、切り抜きされて
形成された孔２ａの長さよりも短くなり、その結果、広
幅部３ｂの端部の一部が切り抜きされなかった側板２の
一部に対向した状態となっている。また、この取付部３
の形成方法は、図３に示すように、細幅部３ａと広幅部
３ｂの切り起こし線Ａ、及び係止部３ｃの切り起こし線
Ｂに沿って、図４に示すように切り起こし、且つ、折り
曲げることによって細幅部３ａ、広幅部３ｂ、係止部３
ｃ、及び切り欠き部３ｄを形成するものである。As shown in FIGS. 2 and 4, the mounting portion 3 cut and raised and bent becomes shorter than the length of the cut-out hole 2a, and as a result, the end of the wide portion 3b A part of the part is in a state of facing a part of the side plate 2 that has not been cut out. Also, this mounting part 3
3 is, as shown in FIG. 3, cut and raised along the cut and raised line A of the narrow portion 3a and the wide portion 3b and the cut and raised line B of the locking portion 3c as shown in FIG. By bending, the narrow portion 3a, the wide portion 3b, the locking portion 3
c and a notch 3d.
【０００７】そして、台形状をなす広幅部３ｂを形成す
ると、切り抜きされて形成された孔２ａは、漸次細幅と
なり、取付部３の僅かな折り曲げによっても、広幅部３
ｂの端部が切り抜きされなかった側板２に対向するよう
になり、取付部３の折り曲げ度に融通性を持たせること
が出来る。When the trapezoidal wide portion 3b is formed, the cut-out hole 2a gradually becomes narrower, and even if the mounting portion 3 is slightly bent, the wide portion 3b is formed.
The end of “b” is opposed to the side plate 2 that has not been cut out, and the degree of bending of the mounting portion 3 can be made flexible.
【０００８】また、プリント基板４は、平板状の絶縁基
板５と、この絶縁基板５上に形成された導電層６と、前
記取付部３と対向する位置において、絶縁基板５の側端
に設けられた凹部７とを備えている。そして、導電層６
は、凹部７の周辺にもわたって設けられ、この導電層６
には、ここでは図示しないが、抵抗器、或いはコンデン
サ等の電気部品が半田付けされている。The printed circuit board 4 has a flat insulating substrate 5, a conductive layer 6 formed on the insulating substrate 5, and a side surface of the insulating substrate 5 at a position facing the mounting portion 3. And a recessed portion 7 provided. And the conductive layer 6
Is provided over the periphery of the concave portion 7 and the conductive layer 6
Although not shown here, an electrical component such as a resistor or a capacitor is soldered.
【０００９】このようなプリント基板４は、先ず、その
凹部７を取付部３に合わせて、枠体１内に挿入する。す
ると、プリント基板４によって、取付部３が側板２側に
押し圧されると共に、広幅部３ｂの端部が側板２に弾圧
状態で当接し、また、プリント基板４は、その下面が係
止部３ｃによって掛け止めされる。しかる後、導電層５
と取付部３とを半田付け８することによって、プリント
基板４が枠体１に取り付けられる。そして、半田付け８
された際は、係止部３ｃを設けることによって形成され
た切り欠き部３ｄ内にも半田が回り、プリント基板４の
半田付けが強固になる。また、半田付け８後、プリント
基板４が伸縮したときは、取付部３のバネ性によりその
伸縮が吸収される。First, such a printed circuit board 4 is inserted into the frame 1 with its concave portion 7 aligned with the mounting portion 3. Then, the mounting portion 3 is pressed against the side plate 2 by the printed circuit board 4, and the end of the wide portion 3 b abuts against the side plate 2 in an elastic pressure state. Locked by 3c. Thereafter, the conductive layer 5
The printed circuit board 4 is attached to the frame 1 by soldering 8 to the mounting portion 3. And soldering 8
In this case, the solder also flows into the notch 3d formed by providing the locking portion 3c, and the soldering of the printed circuit board 4 is strengthened. When the printed circuit board 4 expands and contracts after the soldering 8, the expansion and contraction is absorbed by the spring property of the mounting portion 3.
【００１０】また、図５、図６は本発明の他の実施例を
示し、この実施例における取付部３は、前述のものと同
様に、細幅部３ａ、広幅部３ｂ，係止部３ｃ、及び切り
欠き部３ｄを備えているが、広幅部３ｂが矩形状以外
は、前記実施例と同一構成を有している。そして、この
取付部３の形成方法は、図５に示すように、細幅部３ａ
と広幅部３ｂの切り起こし線Ｃ、及び係止部３ｃの切り
起こし線Ｄに沿って、図６に示すように切り起こし、且
つ、折り曲げることによって取付部３を形成するもので
ある。FIGS. 5 and 6 show another embodiment of the present invention. In this embodiment, the mounting portion 3 has a narrow portion 3a, a wide portion 3b, and a locking portion 3c as in the above-described embodiment. , And a notch 3d, but has the same configuration as that of the previous embodiment except that the wide portion 3b is rectangular. Then, as shown in FIG. 5, the method of forming the mounting portion 3 is the narrow width portion 3a.
Along the cut-and-raised line C of the wide portion 3b and the cut-and-raised line D of the locking portion 3c, the mounting portion 3 is formed by cutting and bending as shown in FIG.
【００１１】[0011]
【発明の効果】本発明によれば、プリント基板の取付
時、取付部の広幅部が側板に当接するようにしたもので
あるため、取付部にバネ性を持たせることが出来、プリ
ント基板の伸縮を取付部で吸収出来て、プリント基板の
半田割れのない取付構造を提供できる。また、取付部
は、一端が側板に繋がり、他端が側板に当接した両端支
持のため、従来よりもインダクタンスを約１／２にする
ことが出来、性能を良くすることが出来る。また、切り
起こされた係止部を設けることによって切り欠き部が形
成でき、半田がこの切り欠き部に回り、半田付け強度を
大きく出来、半田剥がれの無い取付構造を提供できる。
更に、取付部の広幅部を台形状にすることにより、取付
部の折り曲げ度に融通性を持たせることが出来、設計、
及び製造に好適な取付構造を提供できる。According to the present invention, when the printed circuit board is mounted, the wide portion of the mounting portion is brought into contact with the side plate. Expansion and contraction can be absorbed by the mounting part,
An attachment structure without solder cracks can be provided. In addition, since the mounting portion is supported at both ends where one end is connected to the side plate and the other end is in contact with the side plate, the inductance can be reduced to about よ り compared to the related art, and the performance can be improved. Further, by providing the cut-and-raised locking portion, a cut-out portion can be formed, the solder turns around the cut-out portion, the soldering strength can be increased, and a mounting structure without solder peeling can be provided.
Furthermore, by making the wide portion of the mounting portion trapezoidal, the degree of bending of the mounting portion can be given flexibility,
And a mounting structure suitable for manufacturing.
【図１】本発明におけるプリント基板の取付構造の一実
施例を示す平面図。FIG. 1 is a plan view showing one embodiment of a printed circuit board mounting structure according to the present invention.
【図２】本発明におけるプリント基板の取付構造の一実
施例に係る要部拡大断面図。FIG. 2 is an enlarged sectional view of a main part according to an embodiment of the printed circuit board mounting structure of the present invention.
【図３】本発明におけるプリント基板の取付構造の一実
施例に係り、その形成方法を説明するための説明図。FIG. 3 is an explanatory view illustrating a method of forming a printed circuit board according to an embodiment of the present invention.
【図４】本発明におけるプリント基板の取付構造の一実
施例に係る要部拡大斜視図。FIG. 4 is an enlarged perspective view of a main part according to an embodiment of the printed circuit board mounting structure of the present invention.
【図５】本発明におけるプリント基板の取付構造の他の
実施例に係り、その形成方法を説明するための説明図。FIG. 5 is an explanatory view illustrating a method of forming a printed circuit board according to another embodiment of the present invention.
【図６】本発明におけるプリント基板の取付構造の他の
実施例に係る要部拡大斜視図。FIG. 6 is an enlarged perspective view of a main part according to another embodiment of the printed circuit board mounting structure of the present invention.
【図７】従来におけるプリント基板の取付構造を示す平
面図。FIG. 7 is a plan view showing a conventional printed circuit board mounting structure.
【図８】従来におけるプリント基板の取付構造を示す要
部拡大断面図。FIG. 8 is an enlarged sectional view of a main part showing a conventional printed circuit board mounting structure.
【図９】従来におけるプリント基板の取付構造に係り、
その形成方法を説明するための説明図。FIG. 9 relates to a conventional printed circuit board mounting structure,
FIG. 4 is an explanatory diagram for explaining a formation method thereof.
【図１０】従来におけるプリント基板の取付構造を示す
要部拡大斜視図。FIG. 10 is an enlarged perspective view of a main part showing a conventional printed circuit board mounting structure.
１ 枠体 ２ 側板 ２ａ 孔 ３ 取付部 ３ａ 細幅部 ３ｂ 広幅部 ３ｃ 係止部 ３ｄ 切り欠き部 ４ プリント基板 ５ 絶縁基板 ６ 導電層 ７ 凹部 ８ 半田付け REFERENCE SIGNS LIST 1 frame 2 side plate 2a hole 3 mounting portion 3a narrow width portion 3b wide width portion 3c locking portion 3d cutout portion 4 printed board 5 insulating board 6 conductive layer 7 recess 8 soldering
Claims (3)
板に、一端が前記側板に繋がった細幅部と、該細幅部の
端部に設けられた広幅部とから成る取付部を形成し、プ
リント基板に設けた凹部を前記取付部にはめ合わせ、前
記広幅部の端部を前記側板に当接させると共に、前記プ
リント基板の凹部の周辺に設けた導電層を、前記取付部
に半田付けしたことを特徴とするプリント基板の取付構
造。1. A side plate of a frame made of a metal plate which can be soldered is provided with a mounting portion including a narrow portion having one end connected to the side plate and a wide portion provided at an end of the narrow portion. Formed, the concave portion provided on the printed board is fitted to the mounting portion, and the end of the wide portion is brought into contact with the side plate, and the conductive layer provided around the concave portion of the printed board is attached to the mounting portion. A printed circuit board mounting structure characterized by being soldered.
を設け、該係止部によって前記プリント基板を掛け止め
したことを特徴とする請求項１記載のプリント基板の取
付構造。2. The printed circuit board mounting structure according to claim 1, wherein a cut-and-raised locking portion is provided on the mounting portion, and the printed board is hooked and locked by the locking portion.
で、前記細幅部との結合部が短辺の台形状としたことを
特徴とする請求項１、又は２記載のプリント基板の取付
構造。3. The wide-width portion of the mounting portion has a trapezoidal shape in which an end portion has a long side and a connection portion with the narrow width portion has a short side. Mounting structure for printed circuit boards.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31303696A JP3267521B2 (en) | 1996-11-08 | 1996-11-08 | PCB mounting structure |
| GB9721520A GB2319397B (en) | 1996-11-08 | 1997-10-13 | A mounting structure for a printed circuit board to frame |
| CN97121612A CN1087899C (en) | 1996-11-08 | 1997-11-07 | Mounting structure of printed substrate |
| KR1019970058630A KR100266828B1 (en) | 1996-11-08 | 1997-11-07 | Setting structure for print substrate |
| MXPA/A/1997/008623A MXPA97008623A (en) | 1996-11-08 | 1997-11-07 | Mounting structure for print circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31303696A JP3267521B2 (en) | 1996-11-08 | 1996-11-08 | PCB mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10145058A JPH10145058A (en) | 1998-05-29 |
| JP3267521B2 true JP3267521B2 (en) | 2002-03-18 |
Family
ID=18036442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31303696A Expired - Fee Related JP3267521B2 (en) | 1996-11-08 | 1996-11-08 | PCB mounting structure |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3267521B2 (en) |
| KR (1) | KR100266828B1 (en) |
| CN (1) | CN1087899C (en) |
| GB (1) | GB2319397B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4536467B2 (en) | 2004-09-17 | 2010-09-01 | 株式会社エヌ・ティ・ティ・ドコモ | Flat circuit housing |
| JP5014730B2 (en) * | 2006-10-13 | 2012-08-29 | 日置電機株式会社 | Shield case |
| JP2012009471A (en) * | 2010-06-22 | 2012-01-12 | Mitsumi Electric Co Ltd | High-frequency device and printed board holding structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2029645B (en) * | 1978-08-07 | 1982-07-14 | Mitsumi Electric Co Ltd | High-frequency circuit device |
| JPH09260884A (en) * | 1996-03-18 | 1997-10-03 | Alps Electric Co Ltd | Fixing structure of printed board |
-
1996
- 1996-11-08 JP JP31303696A patent/JP3267521B2/en not_active Expired - Fee Related
-
1997
- 1997-10-13 GB GB9721520A patent/GB2319397B/en not_active Expired - Fee Related
- 1997-11-07 CN CN97121612A patent/CN1087899C/en not_active Expired - Fee Related
- 1997-11-07 KR KR1019970058630A patent/KR100266828B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1182347A (en) | 1998-05-20 |
| KR19980042181A (en) | 1998-08-17 |
| JPH10145058A (en) | 1998-05-29 |
| KR100266828B1 (en) | 2000-09-15 |
| CN1087899C (en) | 2002-07-17 |
| GB2319397A (en) | 1998-05-20 |
| GB9721520D0 (en) | 1997-12-10 |
| GB2319397B (en) | 2001-07-11 |
| MX9708623A (en) | 1998-09-30 |
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20011225 |
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| LAPS | Cancellation because of no payment of annual fees |