JPH026441B2 - - Google Patents

Info

Publication number
JPH026441B2
JPH026441B2 JP15899281A JP15899281A JPH026441B2 JP H026441 B2 JPH026441 B2 JP H026441B2 JP 15899281 A JP15899281 A JP 15899281A JP 15899281 A JP15899281 A JP 15899281A JP H026441 B2 JPH026441 B2 JP H026441B2
Authority
JP
Japan
Prior art keywords
lead
transistor
transmission line
circuit
microstrip transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15899281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5859601A (ja
Inventor
Haruki Nishida
Zenichi Oosawa
Isamu Unno
Hiroyuki Sogo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15899281A priority Critical patent/JPS5859601A/ja
Publication of JPS5859601A publication Critical patent/JPS5859601A/ja
Publication of JPH026441B2 publication Critical patent/JPH026441B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/04Fixed joints
    • H01P1/047Strip line joints

Landscapes

  • Waveguide Connection Structure (AREA)
JP15899281A 1981-10-06 1981-10-06 マイクロストリツプ伝送線路の接続構造 Granted JPS5859601A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15899281A JPS5859601A (ja) 1981-10-06 1981-10-06 マイクロストリツプ伝送線路の接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15899281A JPS5859601A (ja) 1981-10-06 1981-10-06 マイクロストリツプ伝送線路の接続構造

Publications (2)

Publication Number Publication Date
JPS5859601A JPS5859601A (ja) 1983-04-08
JPH026441B2 true JPH026441B2 (id) 1990-02-09

Family

ID=15683849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15899281A Granted JPS5859601A (ja) 1981-10-06 1981-10-06 マイクロストリツプ伝送線路の接続構造

Country Status (1)

Country Link
JP (1) JPS5859601A (id)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111206U (id) * 1984-12-25 1986-07-14
JPS62247603A (ja) * 1986-04-15 1987-10-28 Fujitsu Ltd チツプ抵抗器の実装構造
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
US4996582A (en) * 1988-09-14 1991-02-26 Mitsubishi Denki Kabushiki Kaisha Field effect transistor for microstrip mounting and microstrip-mounted transistor assembly

Also Published As

Publication number Publication date
JPS5859601A (ja) 1983-04-08

Similar Documents

Publication Publication Date Title
JP3230398B2 (ja) 同一平面ヒ−トシンクおよび電気コンタクトを有する電子デバイス
US6084310A (en) Semiconductor device, lead frame, and lead bonding
EP1143514A2 (en) Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon
JPH06125021A (ja) 面実装型ダイオード
JPS6390159A (ja) 集積回路接続装置
US4964019A (en) Multilayer bonding and cooling of integrated circuit devices
US5728601A (en) Process for manufacturing a single in-line package for surface mounting
US4658330A (en) Mounting a hybrid circuit to a circuit board
JPH026441B2 (id)
US5383094A (en) Connection lead stucture for surface mountable printed circuit board components
JP2524482B2 (ja) Qfp構造半導体装置
JP2805471B2 (ja) 面実装型ダイオードの製造方法
JPH0236262Y2 (id)
KR100373149B1 (ko) 반도체 패키지
JPS5834758Y2 (ja) マイクロ波装置用パツケ−ジ
JPH0287654A (ja) 表面実装型半導体装置
JPH06104641A (ja) 表面実装型発振器
JPS6366959A (ja) 多重リ−ドフレ−ム
JP2536568B2 (ja) リ―ドフレ―ム
JPH04243302A (ja) 高周波平面回路モジュール
JP2003110049A (ja) 高周波icパッケージ、高周波icパッケージを使用する高周波ユニット及び、その製造方法
JPH0534114Y2 (id)
JPS61270899A (ja) 混成集積回路装置
JPH0414859A (ja) 電子部品のリード端子構造
JPH0514516Y2 (id)