JPH0459776B2 - - Google Patents
Info
- Publication number
- JPH0459776B2 JPH0459776B2 JP61139291A JP13929186A JPH0459776B2 JP H0459776 B2 JPH0459776 B2 JP H0459776B2 JP 61139291 A JP61139291 A JP 61139291A JP 13929186 A JP13929186 A JP 13929186A JP H0459776 B2 JPH0459776 B2 JP H0459776B2
- Authority
- JP
- Japan
- Prior art keywords
- die
- punching
- semiconductor device
- carrier tape
- punched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/701—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139291A JPS6284529A (ja) | 1986-06-17 | 1986-06-17 | キヤリヤテ−プ打抜装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139291A JPS6284529A (ja) | 1986-06-17 | 1986-06-17 | キヤリヤテ−プ打抜装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59273748A Division JPS61154196A (ja) | 1984-12-27 | 1984-12-27 | アウタ−リ−ドボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6284529A JPS6284529A (ja) | 1987-04-18 |
| JPH0459776B2 true JPH0459776B2 (cg-RX-API-DMAC10.html) | 1992-09-24 |
Family
ID=15241862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61139291A Granted JPS6284529A (ja) | 1986-06-17 | 1986-06-17 | キヤリヤテ−プ打抜装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284529A (cg-RX-API-DMAC10.html) |
-
1986
- 1986-06-17 JP JP61139291A patent/JPS6284529A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6284529A (ja) | 1987-04-18 |
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