JPH0458180B2 - - Google Patents
Info
- Publication number
- JPH0458180B2 JPH0458180B2 JP62313328A JP31332887A JPH0458180B2 JP H0458180 B2 JPH0458180 B2 JP H0458180B2 JP 62313328 A JP62313328 A JP 62313328A JP 31332887 A JP31332887 A JP 31332887A JP H0458180 B2 JPH0458180 B2 JP H0458180B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- lead
- resin body
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 61
- 229920005989 resin Polymers 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 23
- 229910000679 solder Inorganic materials 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62313328A JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62313328A JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152735A JPH01152735A (ja) | 1989-06-15 |
| JPH0458180B2 true JPH0458180B2 (en, 2012) | 1992-09-16 |
Family
ID=18039911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62313328A Granted JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152735A (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2630686B2 (ja) * | 1991-03-04 | 1997-07-16 | ローム株式会社 | 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品 |
| JP6064649B2 (ja) * | 2013-02-14 | 2017-01-25 | 大日本印刷株式会社 | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体 |
-
1987
- 1987-12-10 JP JP62313328A patent/JPH01152735A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01152735A (ja) | 1989-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |