JPH045640U - - Google Patents
Info
- Publication number
- JPH045640U JPH045640U JP1990045235U JP4523590U JPH045640U JP H045640 U JPH045640 U JP H045640U JP 1990045235 U JP1990045235 U JP 1990045235U JP 4523590 U JP4523590 U JP 4523590U JP H045640 U JPH045640 U JP H045640U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- metal plate
- showing
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図はこの考案の一実施例である半導体装置
を示す斜視図、第2図は第1図の半導体装置のダ
イボンド部を示す拡大断面図、第3図は従来の半
導体装置を示す斜視図、第4図は第3図の半導体
装置のダイボンド部を示す断面図である。 図において、1……ベースセラミツクス、2…
…メタライズパターン、3……Niめつき層、4
……Au又はAgめつき層、5……フレームセラ
ミツクス、6……外部端子、7……金属板、8…
…放熱フイン、9……半導体チツプ、10……半
田流れ、11……金属細線、12……ろう材を示
す。なお、図中、同一符号は同一、又は相当部分
を示す。
を示す斜視図、第2図は第1図の半導体装置のダ
イボンド部を示す拡大断面図、第3図は従来の半
導体装置を示す斜視図、第4図は第3図の半導体
装置のダイボンド部を示す断面図である。 図において、1……ベースセラミツクス、2…
…メタライズパターン、3……Niめつき層、4
……Au又はAgめつき層、5……フレームセラ
ミツクス、6……外部端子、7……金属板、8…
…放熱フイン、9……半導体チツプ、10……半
田流れ、11……金属細線、12……ろう材を示
す。なお、図中、同一符号は同一、又は相当部分
を示す。
Claims (1)
- メタライズを施した基板上にチツプをダイボン
ドした後、その同一メタライズパターンからコレ
クタリード配線のためのワイヤボンドを行う際ワ
イヤボンデイングパツド用金属板をろう付けした
ことを特徴とする半導体パツケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990045235U JPH045640U (ja) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990045235U JPH045640U (ja) | 1990-04-27 | 1990-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH045640U true JPH045640U (ja) | 1992-01-20 |
Family
ID=31559228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990045235U Pending JPH045640U (ja) | 1990-04-27 | 1990-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH045640U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008244399A (ja) * | 2007-03-29 | 2008-10-09 | Nichia Corp | 発光装置 |
-
1990
- 1990-04-27 JP JP1990045235U patent/JPH045640U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008244399A (ja) * | 2007-03-29 | 2008-10-09 | Nichia Corp | 発光装置 |
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