JPH03101521U - - Google Patents
Info
- Publication number
- JPH03101521U JPH03101521U JP1990009193U JP919390U JPH03101521U JP H03101521 U JPH03101521 U JP H03101521U JP 1990009193 U JP1990009193 U JP 1990009193U JP 919390 U JP919390 U JP 919390U JP H03101521 U JPH03101521 U JP H03101521U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die
- groove
- chip
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図はこの考案の一実施例による半導体装置
を示す斜視図、第2図は第1図の断面図、第3図
はこの考案の他の実施例による半導体装置を示す
斜視図、第4図は従来の半導体装置を示す斜視図
、第5図は第4図は断面図である。 図において、1……メタライズパターン、1a
……溝、2……Niめつき層、3……Auあるい
はAgめつき層、4……半田層、5……半導体チ
ツプ、6……金属細線を示す。尚、図中、同一符
号は同一、又は相当部分を示す。
を示す斜視図、第2図は第1図の断面図、第3図
はこの考案の他の実施例による半導体装置を示す
斜視図、第4図は従来の半導体装置を示す斜視図
、第5図は第4図は断面図である。 図において、1……メタライズパターン、1a
……溝、2……Niめつき層、3……Auあるい
はAgめつき層、4……半田層、5……半導体チ
ツプ、6……金属細線を示す。尚、図中、同一符
号は同一、又は相当部分を示す。
Claims (1)
- メタライズを施した基板上にチツプをダイボン
ドした後、その同一メタライズパターンからコレ
クタリード配線のためのワイヤーボンドを行う際
、障害となるダイボンド時の半田流力を防止する
溝を前記メタライズに設けたことを特徴とする半
導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009193U JPH03101521U (ja) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990009193U JPH03101521U (ja) | 1990-02-01 | 1990-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101521U true JPH03101521U (ja) | 1991-10-23 |
Family
ID=31512797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990009193U Pending JPH03101521U (ja) | 1990-02-01 | 1990-02-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101521U (ja) |
-
1990
- 1990-02-01 JP JP1990009193U patent/JPH03101521U/ja active Pending
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