JPH0385640U - - Google Patents

Info

Publication number
JPH0385640U
JPH0385640U JP1989148086U JP14808689U JPH0385640U JP H0385640 U JPH0385640 U JP H0385640U JP 1989148086 U JP1989148086 U JP 1989148086U JP 14808689 U JP14808689 U JP 14808689U JP H0385640 U JPH0385640 U JP H0385640U
Authority
JP
Japan
Prior art keywords
pattern
die
metallized
semiconductor device
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989148086U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989148086U priority Critical patent/JPH0385640U/ja
Publication of JPH0385640U publication Critical patent/JPH0385640U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の一実施例である半導体装置
を示す斜視図、第2図は従来の半導体装置を示す
斜視図である。 図において、1……メタライズパターン、1a
……スリツトA、1b……スリツトB、2……半
導体チツプ、4……金属細線を示す。尚、図中、
同一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. メタライズを施した基板上に半導体チツプをダ
    イボンドした後、その同一メタライズパターンか
    らコレクタリード配線のためのワイヤーボンドを
    行う際、障害となるダイボンド時の半田流れを防
    ぐためパターンにメタライズの欠損部を設けたこ
    とを特徴とする半導体装置。
JP1989148086U 1989-12-21 1989-12-21 Pending JPH0385640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989148086U JPH0385640U (ja) 1989-12-21 1989-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989148086U JPH0385640U (ja) 1989-12-21 1989-12-21

Publications (1)

Publication Number Publication Date
JPH0385640U true JPH0385640U (ja) 1991-08-29

Family

ID=31694551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989148086U Pending JPH0385640U (ja) 1989-12-21 1989-12-21

Country Status (1)

Country Link
JP (1) JPH0385640U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006524904A (ja) * 2003-02-10 2006-11-02 スカイワークス ソリューションズ,インコーポレイテッド インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006524904A (ja) * 2003-02-10 2006-11-02 スカイワークス ソリューションズ,インコーポレイテッド インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ

Similar Documents

Publication Publication Date Title
JPH0385640U (ja)
JPH01171047U (ja)
JPH03101521U (ja)
JPH045640U (ja)
JPH0336137U (ja)
JPS63187330U (ja)
JPS64332U (ja)
JPS6312844U (ja)
JPH0247062U (ja)
JPH045641U (ja)
JPH0468551U (ja)
JPS63147831U (ja)
JPS62122359U (ja)
JPH02138435U (ja)
JPS62204328U (ja)
JPS6161833U (ja)
JPS587338U (ja) 半導体装置用グランドチツプ
JPH0245676U (ja)
JPH038445U (ja)
JPH0313752U (ja)
JPS6232556U (ja)
JPH0323944U (ja)
JPH0385638U (ja)
JPS63140642U (ja)
JPS63170983U (ja)