JPH0456327U - - Google Patents
Info
- Publication number
- JPH0456327U JPH0456327U JP9998890U JP9998890U JPH0456327U JP H0456327 U JPH0456327 U JP H0456327U JP 9998890 U JP9998890 U JP 9998890U JP 9998890 U JP9998890 U JP 9998890U JP H0456327 U JPH0456327 U JP H0456327U
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- nozzle
- semiconductor wafer
- opening
- jetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 2
Landscapes
- Nozzles (AREA)
Description
第１図は本考案の実施例１の断面図、第２図は
実施例２の断面図、第３図ａ，ｂは従来のノズル
の断面図を示す。 １……ノズル、２……継手、３……送液配管、
４……開閉弁、５……高圧空気供給口、６……洗
浄液供給口、７……洗浄液排液口、８……弁座。
実施例２の断面図、第３図ａ，ｂは従来のノズル
の断面図を示す。 １……ノズル、２……継手、３……送液配管、
４……開閉弁、５……高圧空気供給口、６……洗
浄液供給口、７……洗浄液排液口、８……弁座。
Claims (1)
- 半導体ウエーハ上に塗布処理用液体を噴出する
ための半導体ウエーハ枚葉式回転処理装置の液体
用ノズルにおいて、ノズル先端の液体噴出開口部
を開閉する弁機構を有することを特徴とする半導
体ウエーハ枚葉式回転処理装置の液体用ノズル。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9998890U JPH0456327U (ja) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9998890U JPH0456327U (ja) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456327U true JPH0456327U (ja) | 1992-05-14 |
Family
ID=31842303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9998890U Pending JPH0456327U (ja) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456327U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10176763A (ja) * | 1996-12-17 | 1998-06-30 | Agency Of Ind Science & Technol | 薄膜製造装置用噴霧ノズル弁 |
| JP2016168541A (ja) * | 2015-03-12 | 2016-09-23 | 株式会社荏原製作所 | 基板処理装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165618A (ja) * | 1988-12-19 | 1990-06-26 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
| JPH03245869A (ja) * | 1990-02-22 | 1991-11-01 | Fujitsu Ltd | 薬液塗布装置の吐出薬液劣化防止機構 |
-
1990
- 1990-09-25 JP JP9998890U patent/JPH0456327U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165618A (ja) * | 1988-12-19 | 1990-06-26 | Mitsubishi Electric Corp | 半導体素子の製造装置 |
| JPH03245869A (ja) * | 1990-02-22 | 1991-11-01 | Fujitsu Ltd | 薬液塗布装置の吐出薬液劣化防止機構 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10176763A (ja) * | 1996-12-17 | 1998-06-30 | Agency Of Ind Science & Technol | 薄膜製造装置用噴霧ノズル弁 |
| JP2016168541A (ja) * | 2015-03-12 | 2016-09-23 | 株式会社荏原製作所 | 基板処理装置 |