JPH0227724U - - Google Patents
Info
- Publication number
- JPH0227724U JPH0227724U JP10620188U JP10620188U JPH0227724U JP H0227724 U JPH0227724 U JP H0227724U JP 10620188 U JP10620188 U JP 10620188U JP 10620188 U JP10620188 U JP 10620188U JP H0227724 U JPH0227724 U JP H0227724U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- back surface
- dripping
- rotating
- spray nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000007921 spray Substances 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図である
。 １…半導体基板、２…真空チヤツク、３…滴下
ノズル、４…噴射ノズル、５…塗布膜。
。 １…半導体基板、２…真空チヤツク、３…滴下
ノズル、４…噴射ノズル、５…塗布膜。
Claims (1)
- 半導体基板表面に液体を滴下し回転塗布する塗
布装置において、前記半導体基板裏面周辺部に液
体又は気体を噴射する噴射ノズルを前記半導体基
板裏面付近に設置したことを特徴とする塗布装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620188U JPH0227724U (ja) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10620188U JPH0227724U (ja) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227724U true JPH0227724U (ja) | 1990-02-22 |
Family
ID=31339500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10620188U Pending JPH0227724U (ja) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227724U (ja) |
-
1988
- 1988-08-10 JP JP10620188U patent/JPH0227724U/ja active Pending