JPH0454377B2 - - Google Patents

Info

Publication number
JPH0454377B2
JPH0454377B2 JP57029294A JP2929482A JPH0454377B2 JP H0454377 B2 JPH0454377 B2 JP H0454377B2 JP 57029294 A JP57029294 A JP 57029294A JP 2929482 A JP2929482 A JP 2929482A JP H0454377 B2 JPH0454377 B2 JP H0454377B2
Authority
JP
Japan
Prior art keywords
conductor
substrate
printing
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57029294A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58147037A (ja
Inventor
Susumu Toba
Mamoru Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP57029294A priority Critical patent/JPS58147037A/ja
Publication of JPS58147037A publication Critical patent/JPS58147037A/ja
Publication of JPH0454377B2 publication Critical patent/JPH0454377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W46/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10W46/301—
    • H10W46/601—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP57029294A 1982-02-25 1982-02-25 混成集積回路 Granted JPS58147037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57029294A JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029294A JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS58147037A JPS58147037A (ja) 1983-09-01
JPH0454377B2 true JPH0454377B2 (cg-RX-API-DMAC10.html) 1992-08-31

Family

ID=12272218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57029294A Granted JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS58147037A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130240U (ja) * 1984-07-26 1986-02-24 富士通株式会社 ダイボンダ−
WO2007057954A1 (ja) * 2005-11-17 2007-05-24 Fujitsu Limited 半導体装置及びその製造方法
JP4618738B2 (ja) * 2007-08-24 2011-01-26 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体チップの固定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate

Also Published As

Publication number Publication date
JPS58147037A (ja) 1983-09-01

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