JPS58147037A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS58147037A
JPS58147037A JP57029294A JP2929482A JPS58147037A JP S58147037 A JPS58147037 A JP S58147037A JP 57029294 A JP57029294 A JP 57029294A JP 2929482 A JP2929482 A JP 2929482A JP S58147037 A JPS58147037 A JP S58147037A
Authority
JP
Japan
Prior art keywords
conductor
integrated circuit
dark
hybrid integrated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57029294A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0454377B2 (cg-RX-API-DMAC10.html
Inventor
Susumu Toba
鳥羽　進
Mamoru Ariga
有賀　守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP57029294A priority Critical patent/JPS58147037A/ja
Publication of JPS58147037A publication Critical patent/JPS58147037A/ja
Publication of JPH0454377B2 publication Critical patent/JPH0454377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W46/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H10W46/301—
    • H10W46/601—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP57029294A 1982-02-25 1982-02-25 混成集積回路 Granted JPS58147037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57029294A JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57029294A JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Publications (2)

Publication Number Publication Date
JPS58147037A true JPS58147037A (ja) 1983-09-01
JPH0454377B2 JPH0454377B2 (cg-RX-API-DMAC10.html) 1992-08-31

Family

ID=12272218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57029294A Granted JPS58147037A (ja) 1982-02-25 1982-02-25 混成集積回路

Country Status (1)

Country Link
JP (1) JPS58147037A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130240U (ja) * 1984-07-26 1986-02-24 富士通株式会社 ダイボンダ−
WO2007057954A1 (ja) * 2005-11-17 2007-05-24 Fujitsu Limited 半導体装置及びその製造方法
JP2008047926A (ja) * 2007-08-24 2008-02-28 Nitto Denko Corp ダイシング・ダイボンドフィルム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130240U (ja) * 1984-07-26 1986-02-24 富士通株式会社 ダイボンダ−
WO2007057954A1 (ja) * 2005-11-17 2007-05-24 Fujitsu Limited 半導体装置及びその製造方法
JP2008047926A (ja) * 2007-08-24 2008-02-28 Nitto Denko Corp ダイシング・ダイボンドフィルム

Also Published As

Publication number Publication date
JPH0454377B2 (cg-RX-API-DMAC10.html) 1992-08-31

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