JPH0452997Y2 - - Google Patents
Info
- Publication number
- JPH0452997Y2 JPH0452997Y2 JP1987138838U JP13883887U JPH0452997Y2 JP H0452997 Y2 JPH0452997 Y2 JP H0452997Y2 JP 1987138838 U JP1987138838 U JP 1987138838U JP 13883887 U JP13883887 U JP 13883887U JP H0452997 Y2 JPH0452997 Y2 JP H0452997Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- protrusion
- sealing frame
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 240000005499 Sasa Species 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 9
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000000057 synthetic resin Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987138838U JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987138838U JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6444637U JPS6444637U (de) | 1989-03-16 |
JPH0452997Y2 true JPH0452997Y2 (de) | 1992-12-14 |
Family
ID=31401547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987138838U Expired JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0452997Y2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007294993A (ja) * | 1994-03-11 | 2007-11-08 | Quantum Leap Packaging Inc | 組立て型半導体チップキャリア |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236541B2 (de) * | 1980-08-29 | 1987-08-07 | Fujitsu Ltd |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236541U (de) * | 1985-08-20 | 1987-03-04 |
-
1987
- 1987-09-12 JP JP1987138838U patent/JPH0452997Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236541B2 (de) * | 1980-08-29 | 1987-08-07 | Fujitsu Ltd |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007294993A (ja) * | 1994-03-11 | 2007-11-08 | Quantum Leap Packaging Inc | 組立て型半導体チップキャリア |
Also Published As
Publication number | Publication date |
---|---|
JPS6444637U (de) | 1989-03-16 |
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