JPS6444637U - - Google Patents
Info
- Publication number
- JPS6444637U JPS6444637U JP13883887U JP13883887U JPS6444637U JP S6444637 U JPS6444637 U JP S6444637U JP 13883887 U JP13883887 U JP 13883887U JP 13883887 U JP13883887 U JP 13883887U JP S6444637 U JPS6444637 U JP S6444637U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- protrusion
- sealing frame
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987138838U JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987138838U JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6444637U true JPS6444637U (de) | 1989-03-16 |
JPH0452997Y2 JPH0452997Y2 (de) | 1992-12-14 |
Family
ID=31401547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987138838U Expired JPH0452997Y2 (de) | 1987-09-12 | 1987-09-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0452997Y2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6339191B1 (en) * | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236541U (de) * | 1985-08-20 | 1987-03-04 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5744868A (en) * | 1980-08-29 | 1982-03-13 | Fujitsu Ltd | Measuring method for magnetostriction constant |
-
1987
- 1987-09-12 JP JP1987138838U patent/JPH0452997Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6236541U (de) * | 1985-08-20 | 1987-03-04 |
Also Published As
Publication number | Publication date |
---|---|
JPH0452997Y2 (de) | 1992-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6444637U (de) | ||
JPH021829Y2 (de) | ||
JPH0317644U (de) | ||
JPS6346844U (de) | ||
JPH0420236U (de) | ||
JPH01121942U (de) | ||
JPS6444171U (de) | ||
JPS60113655U (ja) | 複数色発光半導体装置 | |
JPS61182036U (de) | ||
JPS60943U (ja) | 集積回路装置 | |
JPS61111160U (de) | ||
JPS63132441U (de) | ||
JPS6045447U (ja) | 半導体装置 | |
JPS6133450U (ja) | 半導体装置用リ−ドフレ−ム | |
JPS5881940U (ja) | 半導体素子の取付構造 | |
JPS6117689U (ja) | 時計ケ−ス | |
JPS6365245U (de) | ||
JPS6234445U (de) | ||
JPS6294614U (de) | ||
JPS5895054U (ja) | 半導体装置 | |
JPH0388350U (de) | ||
JPS6284928U (de) | ||
JPH0183347U (de) | ||
JPS633154U (de) | ||
JPH0375533U (de) |